H01S 5/0236
Using an adhesive
Official title: using an adhesive
H01S5/0236 (Using an adhesive) appears on 122 US grants and 172 published applications in this corpus.
Search patents in H01S- Granted patents
- 122
- Published applications
- 172
- Assignees
- 104
- Inventors
- 377
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 2 |
| 2002 | 0 | 3 |
| 2003 | 3 | 2 |
| 2004 | 4 | 4 |
| 2005 | 4 | 3 |
| 2006 | 1 | 3 |
| 2007 | 2 | 1 |
| 2008 | 1 | 2 |
| 2009 | 2 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 1 | 4 |
| 2014 | 3 | 5 |
| 2015 | 5 | 4 |
| 2016 | 6 | 8 |
| 2017 | 6 | 7 |
| 2018 | 4 | 9 |
| 2019 | 11 | 20 |
| 2020 | 12 | 16 |
| 2021 | 12 | 18 |
| 2022 | 6 | 14 |
| 2023 | 8 | 11 |
| 2024 | 12 | 17 |
| 2025 | 9 | 11 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser light source and method of manufacturing the same1 Sep 2026US 12,725,999 B2Furukawa Electric Co., Ltd.
- Bonding device and bonding method1 Sep 2026US 12,726,000 B2Sumitomo Electric Industries, Ltd.
- External resonant laser module7 Jul 2026US 12,676,457 B2Hamamatsu Photonics K.K.
- Light-emitting device and method of manufacturing light-emitting device30 Jun 2026US 12,671,226 B2Nichia Corporation
- Laser chips attached to a photonics chip by multiple adhesives23 Jun 2026US 12,665,384 B2GLOBALFOUNDRIES U. S. Inc.
- Surface-emitting laser device30 Jul 2026US 2026/0221721 A1Kyoto University
- Element mounting structure4 Jun 2026US 2026/0155622 A1Mitsubishi Electric Corporation
- Carrier based laser assembly for high volume integration onto a substrate7 May 2026US 2026/0128566 A1Ranovus Inc.
- Method of manufacturing light-emitting device2 Apr 2026US 2026/0095021 A1Nichia Corporation
- Optical module packaging structure and method of manufacturing the same4 Dec 2025US 2025/0372941 A1Primax Electronics Ltd.
Most cited
By later US patents
- Optical device structure and fabrication method thereof37US 6,771,677 B2Canon Kabushiki Kaisha · 2004
- Power source control apparatus for laser diode36US 6,137,816 AMitsubishi Denki Kabushiki Kaisha · 2000
- Optical device structure and fabrication method thereof23US 6,507,594 B1Canon Kabushiki Kaisha · 2003
- Low cost optical pump laser package16US 10,283,939 B2nLIGHT, Inc. · 2019
- Hybrid type integrated optical device15US 7,522,648 B2Electronics and Telecommunications Research Institute · 2009