Laser chips attached to a photonics chip by multiple adhesives

A method comprising:

• forming a first adhesive on a surface of a photonics chip, wherein the first adhesive has a first thermal conductivity, and the first adhesive includes a first section and a second section;
• placing a laser chip including a light output and a body that are spaced from the surface of the photonics chip, wherein the body of the laser chip includes a surface, and the first adhesive is disposed between the surface of the body of the laser chip and the surface of the photonics chip;
• and
• forming a second adhesive between the surface of the body of the laser chip and the surface of the photonics chip, wherein the second adhesive has a second thermal conductivity that is less than the first thermal conductivity of the first adhesive, the second adhesive is positioned in a lateral direction between the first section and the second section of the first adhesive, and the second adhesive is disposed in a light path between the light output of the laser chip and the surface of the photonics chip,
• wherein the photonics chip includes a grating coupler, and the laser chip is configured to emit light from the light output that propagates in the light path through the second adhesive toward the grating coupler.