Optical device structure and fabrication method thereof

An optical device structure comprising:

• a first substrate structure, said first substrate structure including a first substrate, at least an active region formed on said first substrate, and at least a first electric connector portion provided corresponding to said active region for injecting a current into or applying a voltage to said active region;
• a second substrate structure, said second substrate structure including a second substrate, and at least a second electric connector portion formed on said second substrate corresponding to said first electric connector portion;
• and
• an anisotropic electrically-conductive adhesive containing electrically-conductive particles, said first and second substrates being bonded to each other by said anisotropic electrically-conductive adhesive, and said first and second electric connector portions on said first and second substrates being electrically connected to each other by said electrically-conductive particles between said first and second electric connector portions,
• said first substrate structure including a first protruding portion with said first electric connector portion formed corresponding to said active region and a second protruding portion formed near said active region a height of said first protruding portion being larger than a height of said second protruding portion, said first protruding portion being electrically connected to said second electric connector portion through said first electric connector portion, and said second protruding portion being insulated from said second electric connector portion.

An optical device structure comprising:

• a first substrate structure, said first substrate structure including a first substrate, at least an active region formed on said first substrate, and at least a first electric connector portion provided corresponding to said active region for injecting a current into or applying a voltage to said active region;
• a second substrate structure, said second substrate structure including a second substrate, and at least a second electric connector portion formed on said second substrate corresponding to said first electric connector portion;
• and
• an anisotropic electrically-conductive adhesive containing electrically-conductive particles, said first and second substrates being bonded to each other by said anisotropic electrically-conductive adhesive, and said first and second electric connector portions on said first and second substrates being electrically connected to each other by said electrically-conductive particles between said first and second electric connector portions,
• said first substrate structure including a first protruding portion with said first electric connector portion formed corresponding to said active region and a second protruding portion with said first electric connector portion formed near said active region, a height of said first protruding portion being substantially equal to a height of said second protruding portion, said first protruding portion being electrically connected to said second electric connector portion through said first electric connector portion, and said second protruding portion also being electrically connected to said second electric connector portion through said first electric connector portion.

An optical device structure comprising:

• a first substrate structure, said first substrate structure including a first substrate, at least an active region formed on said first substrate, and at least a first electric connector portion provided corresponding to said active region for injecting a current into or applying a voltage to said active region;
• a second substrate structure, said second substrate structure including a second substrate, and at least a second electric connector portion formed on said second substrate corresponding to said first electric connector portion;
• and
• an anisotropic electrically-conductive adhesive containing electrically-conductive particles, said first and second substrates being bonded to each other by said anisotropic electrically-conductive adhesive, and said first and second electric connector portions on said first and second substrates being electrically connected to each other by said electrically-conductive particles between said first and second electric connector portions,
• all or almost all of said first substrate being removed, and a multi-layer mirror being formed on a semiconductor surface exposed by the removal of said first substrate.