H01S 5/02326
Arrangements for relative positioning of laser diodes and optical components
Official title: Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
H01S5/02326 (Arrangements for relative positioning of laser diodes and optical components) appears on 925 US grants and 1,023 published applications in this corpus.
Search patents in H01S- Granted patents
- 925
- Published applications
- 1,023
- Assignees
- 431
- Inventors
- 2,012
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 7 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 8 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 10 | 0 |
| 1997 | 10 | 0 |
| 1998 | 12 | 0 |
| 1999 | 13 | 0 |
| 2000 | 17 | 0 |
| 2001 | 19 | 4 |
| 2002 | 17 | 45 |
| 2003 | 22 | 47 |
| 2004 | 33 | 38 |
| 2005 | 34 | 24 |
| 2006 | 22 | 19 |
| 2007 | 13 | 27 |
| 2008 | 13 | 19 |
| 2009 | 19 | 14 |
| 2010 | 20 | 21 |
| 2011 | 10 | 18 |
| 2012 | 15 | 26 |
| 2013 | 18 | 31 |
| 2014 | 27 | 25 |
| 2015 | 33 | 35 |
| 2016 | 29 | 34 |
| 2017 | 35 | 47 |
| 2018 | 42 | 63 |
| 2019 | 57 | 67 |
| 2020 | 67 | 87 |
| 2021 | 46 | 75 |
| 2022 | 50 | 74 |
| 2023 | 51 | 75 |
| 2024 | 49 | 46 |
| 2025 | 38 | 37 |
| 2026 | 27 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Method for fabricating self-assembling microstructures513US 5,545,291 AThe Regents of the University of California · 1996
- Apparatus for fabricating self-assembling microstructures356US 5,904,545 AThe Regents of the University of California · 1999
- Method for fabricating self-assembling microstructures220US 5,783,856 AThe Regents of the University of California · 1998
- Monolithic scanning light emitting devices using micromachining198US 6,180,428 B2Xerox Corporation · 2001
- Method for encapsulating light emitting diodes182US 5,516,727 AInternational Business Machines Corporation · 1996