Method for fabricating self-assembling microstructures
AssigneeThe Regents of the University of California
InventorsJohn Stephen Smith, Hsi-Jen J. Yeh
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Abstract
A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, 120, 200. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.
Claims34
A microstructure comprising:
- a substrate having a plurality of recessed tapered regions thereon;
- and
- a plurality of shaped blocks integral with said recessed regions, each of said shaped blocks having a tapered shape to complement said recessed regions and comprising at least a portion of an integrated circuit thereon, said substrate with said plurality of shared blocks to form at least one integrated circuit when said plurality of shaped blocks are disposed in said recessed regions and appropriately connected.
A structure comprising a plurality of integrated circuit devices thereon, said structure comprising;
- a substrate having a top surface;
- a sacrificial layer made from a material selected from the group consisting of aluminum arsenide, indium phosphate, and silicon dioxide overlying said top surface, said sacrificial layer comprising a sacrificial layer surface;
- and
- a block layer overlying said sacrificial layer surface;
- wherein said block layer comprises a plurality of shaped blocks on and in contact with said sacrificial layer surface, and wherein at least one of said plurality of shaped blocks is to be freed from at least another of said plurality of shaped blocks and from said substrate when said sacrificial layer is removed, and wherein said plurality of shaped blocks includes integrated circuit devices thereon.
A structure comprising integrated circuit devices thereon, said structure comprising:
- a substrate including a release layer overlying said substrate, and a block layer overlying said release layer, said release layer being an etchable layer;
- wherein said block layer comprises a plurality of shaped blocks, each of said plurality of shaped blocks comprising a portion of an integrated circuit device thereon, and wherein at least one of said plurality of shaped blocks is to be freed from at least another of said plurality of shaped blocks and from said substrate when said release layer is etched.
Dependencies are inferred from the claim text.