Light-emitting apparatus and method of assembling light-emitting apparatus

Abstract

There are provided a light-emitting apparatus and a method of assembling the light-emitting apparatus capable of more efficiently dissipating heat, which is generated by a semiconductor light-emitting chip, from a base to a holder. The light-emitting apparatus includes: a package including a base, a cap that is mounted on an upper surface of the base, and a semiconductor light-emitting chip disposed in the cap; and a holder that holds the package. The holder has a through-hole into which the package is inserted and a cylindrical portion disposed around an opening of the through-hole on the upper surface of the holder. The cylindrical portion covers at least a part of an outer circumferential surface of the cap of the package inserted into the through-hole. An inner wall surface of the through-hole has a step. A first gap portion is provided between the step and the upper surface of the base on which the cap is not mounted. A second gap portion continuous with the first gap portion is provided between an inner wall surface of the cylindrical portion and the outer circumferential surface of the cap. A thermally conductive gel having a higher thermal conductivity than air fills the first gap portion and the second gap portion.

Dependencies are inferred from the claim text.