H01R 12/57
Surface mounting terminals
Official title: surface mounting terminals
H01R12/57 (Surface mounting terminals) appears on 2,435 US grants and 2,187 published applications in this corpus.
Search patents in H01R- Granted patents
- 2,435
- Published applications
- 2,187
- Assignees
- 780
- Inventors
- 4,069
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 8 | 0 |
| 1986 | 9 | 0 |
| 1987 | 9 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 11 | 0 |
| 1991 | 19 | 0 |
| 1992 | 18 | 0 |
| 1993 | 28 | 0 |
| 1994 | 19 | 0 |
| 1995 | 26 | 0 |
| 1996 | 30 | 0 |
| 1997 | 37 | 0 |
| 1998 | 55 | 0 |
| 1999 | 51 | 0 |
| 2000 | 83 | 0 |
| 2001 | 66 | 24 |
| 2002 | 66 | 59 |
| 2003 | 73 | 62 |
| 2004 | 76 | 52 |
| 2005 | 52 | 96 |
| 2006 | 78 | 69 |
| 2007 | 58 | 73 |
| 2008 | 69 | 90 |
| 2009 | 83 | 100 |
| 2010 | 89 | 94 |
| 2011 | 97 | 93 |
| 2012 | 78 | 87 |
| 2013 | 55 | 71 |
| 2014 | 49 | 58 |
| 2015 | 58 | 57 |
| 2016 | 64 | 65 |
| 2017 | 84 | 52 |
| 2018 | 64 | 107 |
| 2019 | 106 | 130 |
| 2020 | 127 | 120 |
| 2021 | 100 | 128 |
| 2022 | 88 | 109 |
| 2023 | 80 | 131 |
| 2024 | 68 | 113 |
| 2025 | 99 | 76 |
| 2026 | 69 | 71 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connector assembly with improved heat dissipation effect6 Oct 2026US 12,756,145 B2Dongguan Luxshare Technologies Co., Ltd
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Socket interconnect structures and related methods8 Sep 2026US 12,731,947 B2Intel Corporation
- Two-way receptacle for universal serial bus1 Sep 2026US 12,725,955 B2SanDisk Technologies LLC
- Connector to electrically couple multiple substrates25 Aug 2026US 12,719,185 B2Intel Corporation
- Connector with improved shielding chamber24 Sep 2026US 2026/0291141 A1Dongguan Luxshare Technologies Co., Ltd
- Connector assembly with improved heat dissipation effect17 Sep 2026US 2026/0280196 A1Dongguan Luxshare Technologies Co., Ltd
- High performance connector with bga signal attachment10 Sep 2026US 2026/0269497 A1Amphenol Corporation
- Terminal for a power module and method for manufacturing a terminal for a power module3 Sep 2026US 2026/0261061 A1Hitachi Energy Ltd
- Elastic Contact Terminal for the End of a Lamp, and a Lamp Comprising the Same27 Aug 2026US 2026/0251272 A1Self Electronics Co., Ltd.
Most cited
By later US patents
- Chip assembly for reusable surgical instruments801US 9,636,112 B2Covidien LP · 2017
- Chip assembly for reusable surgical instruments666US 9,833,235 B2Covidien LP · 2017
- Authentication and information system for reusable surgical instruments507US 10,420,551 B2Covidien LP · 2019
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991