Socket interconnect structures and related methods
AssigneeIntel Corporation
InventorsKai Xiao, Phil Geng, Carlos Alberto Lizalde Moreno, Raul Enriquez Shibayama, Steven A. Klein
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AssigneeIntel Corporation
InventorsKai Xiao, Phil Geng, Carlos Alberto Lizalde Moreno, Raul Enriquez Shibayama, Steven A. Klein
Estimating the term…
Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.
An apparatus comprising:
A socket comprising:
A method comprising:
Dependencies are inferred from the claim text.