H01R 12/526
The printed circuits being on the same board
Official title: {the printed circuits being on the same board (with plated through holes H05K3/42)}
H01R12/526 (The printed circuits being on the same board) appears on 74 US grants and 56 published applications in this corpus.
Search patents in H01R- Granted patents
- 74
- Published applications
- 56
- Assignees
- 61
- Inventors
- 167
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 3 |
| 2002 | 4 | 3 |
| 2003 | 1 | 7 |
| 2004 | 4 | 4 |
| 2005 | 3 | 2 |
| 2006 | 6 | 5 |
| 2007 | 0 | 2 |
| 2008 | 2 | 1 |
| 2009 | 3 | 1 |
| 2010 | 0 | 3 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 1 |
| 2016 | 2 | 2 |
| 2017 | 5 | 9 |
| 2018 | 5 | 3 |
| 2019 | 4 | 1 |
| 2020 | 3 | 2 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 2 |
| 2025 | 0 | 0 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connector to electrically couple multiple substrates25 Aug 2026US 12,719,185 B2Intel Corporation
- Circuit board assembly with interconnecting fixing brackets holding board-to-board connectors to a circuit board and a device using the same20 Jan 2026US 12,531,357 B2Vivo Mobile Communication Co., Ltd.
- Connector and electronic device comprising same20 Dec 2022US 11,533,814 B2Samsung Electronics Co., Ltd.
- Electrical assembly with a multilayer bus board15 Sep 2020US 10,779,392 B2Interplex Industries, Inc.
- Plated through hole socketing coupled to a solder ball to engage with a pin11 Aug 2020US 10,741,947 B2Intel Corporation
- Electrical busbar device27 Jun 2024US 2024/0213692 A1Mahle International GmbH
- Connector to electrically couple multiple substrates28 Mar 2024US 2024/0106139 A1Intel Corporation
- Circuit board assembly and electronic device8 Jun 2023US 2023/0178909 A1Vivo Mobile Communication Co., Ltd.
- Connector and electronic device comprising same14 Jan 2021US 2021/0014985 A1Samsung Electronics Co., Ltd.
- Electrical assembly with a multilayer bus board20 Feb 2020US 2020/0060022 A1Interplex Industries, Inc.
Most cited
By later US patents
- Slanted vias for electrical circuits on circuit boards and other substrates77US 7,083,425 B2Micron Technology, Inc. · 2006
- Cable assembly adapted with a circuit board63US 6,053,770 AThe Whitaker Corporation · 2000
- Method of manufacturing a high density connector system60US 5,276,964 AInternational Business Machines Corporation · 1994
- Electrical connector on a flexible carrier40US 7,114,961 B2Neoconix, Inc. · 2006
- Electrically conductive wire37US 6,752,310 B2Koninklijke Philips Electronics N. V. · 2004