Plated through hole socketing coupled to a solder ball to engage with a pin

An electronic system, comprising:

• a substrate including a first passageway and a second passageway, wherein:
• the first passageway and the second passageway extend from a first surface of the substrate toward a second surface of the substrate, and
• the first passageway is closed at an end of the first passageway;
• a conductive layer coupled to the second surface of the substrate, wherein the conductive layer closes the end of the first passageway;
• a first plated through hole socket coupled to the first passageway, wherein the first plated through hole socket includes a first end and a second end;
• a second plated through hole socket coupled to the second passageway;
• a first contact, including a first pin, wherein the first pin is configured to be received in the first end of the first plated through hole socket and the first pin is configured to engage with the first plated through hole socket;
• a second contact, including a second pin, wherein the second pin is configured to engage with the second plated through hole socket;
• a first solder ball in electrical communication with the first contact, wherein the first solder ball is coupled to the second end of the first plated through hole socket;
• and
• a second solder ball in electrical communication with the second contact, wherein the second solder ball is coupled to the second plated through hole socket.

A method for manufacturing an electronic device, comprising:

• forming a first passageway in a substrate, wherein the first passageway is closed at an end of the first passageway;
• coupling a conductive layer to a surface of the substrate, wherein the conductive layer closes the end of the passageway;
• plating the first passageway to create a first plated through hole socket, wherein the first plated through hole socket includes a first end and a second end and the first end of the first plated through hole socket is configured to receive a pin, and the pin is configured to engage with the first plated through hole socket;
• and
• coupling a solder ball to the second end of the first plated through hole socket.