Method of manufacturing a high density connector system

A method of manufacturing an electronic connector system comprising the steps of:

• providing an insulating body of liquid crystal polymer having a plurality of conductive traces thereon;
• heating the insulating polymer body to an elevated temperature;
• placing a small shaped piece of solid metal over a respective one of the conductive traces on one level;
• and placing an anvil under a conductive trace on a second level, said anvil having an upper surface facing the conductive trace on the second level;
• and
• driving the small shaped piece of metal by said punch with sufficient force and speed through the conductive trace on said one level into the polymer body and into contact with the conductive trace on the second level thereby essentially deforming the conductive trace on the second level into the upper surface of the anvil and thereby providing mechanical and electrical engagement of the small shaped piece of metal and the conductive traces thereby establishing a via between the traces.

A method of manufacturing an electronic connector system comprising the steps of:

• providing an insulating body of liquid crystal polymer having a plurality of conductive traces thereon;
• heating the insulating polymer body to an elevated temperature;
• placing a small gold cover ball over a respective one of the conductive traces on one level;
• and
• driving the small gold covered ball with sufficient force and speed through the conductive trace said on one level into the polymer body and into contact with a conductive trace on a second level thereby providing mechanical and electrical engagement of the small gold covered ball and the conductive traces thereby establishing a via between the traces.