Electrical assembly with a multilayer bus board
AssigneeInterplex Industries, Inc.
InventorsRichard Schneider, Joseph J. Lynch, Craig Kennedy, Vu Phan
Life of this patent
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Abstract
An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.
Claims20
An electrical assembly, comprising:
- a multilayer bus board comprising:
- a multilayer stacked assembly having a plurality of layer structures including a pair of electrically conductive layer structures and a dielectric layer structure disposed between and adjoining each of the conductive layer structures;
- and
- a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer structure and the conductive layer structures to maintain the conductive layer structures and the dielectric layer structure in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layer structures is exposed;
- and
- an electrical device electrically connected to one or both of the conductive layer structures;
- and
- wherein the layer structures are mechanically held together by the frame and are not secured to each other by adhesive, lamination or other type of bonding.
Dependencies are inferred from the claim text.