H01P 3/121
Integrated in a substrate
Official title: {integrated in a substrate}
H01P3/121 (Integrated in a substrate) appears on 374 US grants and 426 published applications in this corpus.
Search patents in H01P- Granted patents
- 374
- Published applications
- 426
- Assignees
- 197
- Inventors
- 742
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 5 |
| 2003 | 2 | 1 |
| 2004 | 2 | 5 |
| 2005 | 2 | 2 |
| 2006 | 5 | 1 |
| 2007 | 2 | 5 |
| 2008 | 1 | 3 |
| 2009 | 2 | 10 |
| 2010 | 2 | 10 |
| 2011 | 8 | 22 |
| 2012 | 8 | 10 |
| 2013 | 15 | 19 |
| 2014 | 21 | 24 |
| 2015 | 14 | 12 |
| 2016 | 28 | 25 |
| 2017 | 17 | 16 |
| 2018 | 19 | 27 |
| 2019 | 24 | 23 |
| 2020 | 25 | 43 |
| 2021 | 37 | 29 |
| 2022 | 31 | 29 |
| 2023 | 32 | 35 |
| 2024 | 24 | 30 |
| 2025 | 18 | 22 |
| 2026 | 25 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Waveguide element operable up to terahertz frequencies including a dielectric portion having periodic holes of a specified period formed therein and which is mounted on a support substrate6 Oct 2026US 12,756,080 B2NGK Insulators, Ltd.
- Waveguide device operable up to terahertz frequencies including a line substrate having periodic holes formed therein and which is mounted on a support substrate29 Sep 2026US 12,749,785 B2NGK Insulators, Ltd.
- Millimeter wave structure including a shielded substrate having a metal sheet therein and usable in a millimeter wave measurement module22 Sep 2026US 12,744,295 B2Universal Scientific Industrial (Shanghai) Co., Ltd.
- Method for connecting memory device through HEMP/EMI protected barrier15 Sep 2026US 12,738,622 B1Raytheon Company
- Resonator and frequency-tunable resonator25 Aug 2026US 12,719,141 B2National Institute of Advanced Industrial Science and Technology
- Waveguides and fabrication thereof1 Oct 2026US 2026/0302580 A1Jones Microwave Inc
- Chip packages including substrate integrated waveguides3 Sep 2026US 2026/0261029 A1Infineon Technologies AG
- Antenna element, antenna array, and antenna module20 Aug 2026US 2026/0246149 A1Sony Semiconductor Solutions Corporation
- Waveguide6 Aug 2026US 2026/0229760 A1Panasonic Industry Co., Ltd.
- Electronic component6 Aug 2026US 2026/0229768 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Printed circuit board dielectric waveguide core and metallic waveguide end248US 9,515,366 B2Texas Instruments Incorporated · 2016
- High-frequency transmission line connection structure, circuit board, high-frequency module, and radar device229US 8,159,316 B2KYOCERA Corporation · 2012
- Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein206US 10,276,909 B2Invensas Bonding Technologies, Inc. · 2019
- Surface communication device205US 9,070,962 B2NEC Corporation · 2015
- Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system201US 8,983,399 B2Sony Corporation · 2015