Millimeter wave structure including a shielded substrate having a metal sheet therein and usable in a millimeter wave measurement module

A millimeter wave module measure equipment, comprising:

• a measurement carrier board;
• a jig assembled to the measurement carrier board and being configured to carry a millimeter wave module, wherein the millimeter wave module includes a plurality of signal pins;
• and
• a plurality of millimeter wave circuit structures assembled on the measurement carrier board and electrically connected to the plurality of the signal pins, respectively;
• wherein each of the millimeter wave circuit structures includes:
• a substrate provided with a first conductive through hole, a second conductive through hole, a first welding pad and a second welding pad, wherein the first conductive through hole and the second conductive through hole are connected to the first welding pad and the second welding pad, respectively;
• two metal through hole groups, each of the metal through hole groups penetrating the substrate;
• a signal feed-in structure provided inside the substrate and connected to the first conductive through hole and one of the signal pins, correspondingly;
• a signal feed-out structure provided inside the substrate and connected to the second conductive through hole;
• a metal shielding cover connected to a top of the substrate and located between the two metal through hole groups;
• a metal sheet, wherein a first side of the metal sheet is connected to the first welding pad and the second welding pad, the metal sheet is located inside the metal shielding cover and the first side of the metal sheet is provided with a first notch and a second notch, and the metal sheet is electrically connected to the signal feed-in structure and the signal feed-out structure by the first conductive through hole and the second conductive through hole, respectively.