H01P 3/088
Stacked transmission lines
Official title: {Stacked transmission lines}
H01P3/088 (Stacked transmission lines) appears on 262 US grants and 215 published applications in this corpus.
Search patents in H01P- Granted patents
- 262
- Published applications
- 215
- Assignees
- 152
- Inventors
- 608
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 9 | 0 |
| 2001 | 2 | 6 |
| 2002 | 10 | 13 |
| 2003 | 13 | 10 |
| 2004 | 17 | 10 |
| 2005 | 11 | 12 |
| 2006 | 6 | 9 |
| 2007 | 8 | 4 |
| 2008 | 5 | 2 |
| 2009 | 4 | 4 |
| 2010 | 1 | 4 |
| 2011 | 2 | 2 |
| 2012 | 4 | 4 |
| 2013 | 2 | 3 |
| 2014 | 4 | 11 |
| 2015 | 10 | 6 |
| 2016 | 9 | 4 |
| 2017 | 6 | 15 |
| 2018 | 11 | 8 |
| 2019 | 11 | 11 |
| 2020 | 7 | 17 |
| 2021 | 11 | 15 |
| 2022 | 13 | 12 |
| 2023 | 15 | 18 |
| 2024 | 13 | 8 |
| 2025 | 11 | 5 |
| 2026 | 5 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- Transmission line including a multilayer body having a signal conductor layer, ground conductor layers and a hollow portion of varying width11 Aug 2026US 12,706,364 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate and electronic device16 Jun 2026US 12,658,549 B2Murata Manufacturing Co., Ltd.
- Filter device2 Jun 2026US 12,647,088 B2Murata Manufacturing Co., Ltd.
- Multilayer radio frequency component24 Mar 2026US 12,586,885 B2Knowles Cazenovia, Inc.
- Multilayer substrate and electronic device17 Sep 2026US 2026/0280090 A1Murata Manufacturing Co., Ltd.
- Signal transmission device having multilayer structure10 Sep 2026US 2026/0269445 A1M31 Technology Corporation
- Waveguide device, and radar device comprising a waveguide device27 Nov 2025US 2025/0364712 A1
- Delay compensation in conductive trace structures16 Oct 2025US 2025/0324509 A1Intel Corporation
- Electronic device11 Sep 2025US 2025/0286260 A1Innolux Corporation
Most cited
By later US patents
- Voltage tunable laminated dielectric materials for microwave applications171US 6,377,142 B1Paratek Microwave, Inc. · 2002
- Distributed constant circuit board using ceramic substrate material148US 5,232,765 ANGK Insulators, Ltd. · 1993
- Microwave multiport multilayered integrated circuit chip carrier139US 4,739,448 AMagnavox Government and Industrial Electronics Company · 1988
- Thin film multilayered electrode of high frequency electromagnetic field coupling115US 6,148,221 AMurata Manufacturing Co., Ltd. · 2000
- Wiring board, wiring board fabrication method, and semiconductor package112US 6,353,189 B1Kabushiki Kaisha Toshiba · 2002