Multilayer radio frequency component
AssigneeKnowles Cazenovia, Inc.
InventorJared P. Burdick
Life of this patent
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Abstract
A radio frequency (RF) component having a compact form-factor includes a planar transmission line located between first and second dielectric substrates. A first plurality of conductive vias integrated with the first substrate are electrically connected to a second plurality of conductive vias integrated with the second substrate, wherein the electrically connected conductive vias are arranged at least partially about the planar transmission line. The vias are connected to a ground plane on one of the substrates. Multiple RF components can be stacked one atop the other to form an integrated bank of discrete or electrically connected electrical devices implemented as antennas, couplers and filters, among other RF components, and combinations thereof.
Claims20
A radio frequency (RF) component comprising:
- a first RF component comprising a first planar transmission line disposed between first and second dielectric substrates;
- a first ground plane on a first surface of the first RF component;
- a second RF component comprising a second planar transmission line disposed between third and fourth dielectric substrates;
- the second RF component stacked with the first RF component;
- a second ground plane disposed between the first and second RF components, the second ground plane electrically connected to the first ground plane, the first planar transmission line located between the first and second ground planes;
- and
- a third ground plane disposed adjacent a surface of the second RF component and electrically connected to the second ground plane, the second planar transmission line located between the second and third ground planes.
A radio frequency (RF) component comprising:
- a first RF component comprising a planar transmission line between first and second dielectric substrates;
- a first ground plane on a first surface of the first RF component;
- a second RF component stacked relative to a second surface, opposite the first surface, of the first RF component;
- a second ground plane between the first and second RF components, the second ground plane electrically connected to the first ground plane, wherein the planar transmission line is located between the first and second ground planes,
- the first dielectric substrate comprising a first conductive shield portion;
- and
- the second dielectric substrate comprising a second conductive shield portion,
- the first conductive shield portion electrically connected to the second conductive shield portion and to the first ground plane, the electrically connected first and second conductive shield portions arranged at least partially about the planar transmission line.
A thin-film radio frequency (RF) component comprising:
- a first dielectric substrate comprising a planar transmission line at a first surface of the first dielectric substrate and a first plurality of conductive vias;
- a first ground plane at a second surface, opposite the first surface, of the first dielectric substrate, the first plurality of conductive vias electrically connected to the first ground plane;
- a second dielectric substrate comprising a second plurality of conductive vias, a first surface of the second dielectric substrate facing the first surface of the first dielectric substrate, the planar transmission line located between the first and second dielectric substrates;
- the first plurality of conductive vias electrically connected to the second plurality of conductive vias and the electrically connected conductive vias arranged at least partially about the planar transmission line;
- an input electrically coupled to the planar transmission line;
- an output electrically coupled to the planar transmission line.
Dependencies are inferred from the claim text.