H01K 3/10
Machines therefor
H01K3/10 (Machines therefor) appears on 10 US grants and 7 published applications in this corpus.
Search patents in H01K- Granted patents
- 10
- Published applications
- 7
- Assignees
- 9
- Inventors
- 17
- Latest grant
- 22 Sep 2015
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 2 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- EMI compartment shielding structure and fabricating method thereof22 Sep 2015US 9,144,183 B2Universal Scientific Industrial (Shanghai) Co., Ltd.
- Conductive vias in a substrate7 Apr 2015US 8,999,179 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating circuit board structure with concave conductive cylinders26 Nov 2013US 8,590,147 B2Unimicron Technology Corp.
- Light source bodies for filament tubes and ARC tubes12 Oct 2010US 7,811,148 B2Halogen Technologies, Inc.
- Printed wiring board manufacturing method14 Oct 2008US 7,434,311 B2Maruwa Co., Ltd.
- Emi compartment shielding structure and fabricating method thereof5 Feb 2015US 2015/0036296 A1Universal Scientific Industrial (Shanghai) Co., Ltd.
- Conductive Vias In A Substrate7 Feb 2013US 2013/0034816 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating circuit board structure with concave conductive cylinders29 Apr 2010US 2010/0101083 A1Unimicron Technology Corp.
- Circuit board structure with concave conductive cylinders and method for fabricating the same29 Jan 2009US 2009/0025210 A1Unimicron Technology Corp.
- Light source bodies for filament tubes and arc tubes17 Apr 2008US 2008/0090483 A1Halogen Technologies, Inc.
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000
- EMI compartment shielding structure and fabricating method thereof21US 9,144,183 B2Universal Scientific Industrial (Shanghai) Co., Ltd. · 2015
- Method of supporting an electrical circuit on an electrically insulative base substrate10US 5,878,487 AFord Motor Company · 1999
- Light source bodies for filament tubes and ARC tubes9US 7,811,148 B2Halogen Technologies, Inc. · 2010