Circuit board structure with concave conductive cylinders and method for fabricating the same
AssigneeUnimicron Technology Corp.
InventorsShao-Chien Lee, Chih-Ming Chang
Life of this patent
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Abstract
A method for fabricating a circuit board structure with concave conductive cylinders is provided. Firstly, a conductive layer is provided; a plurality of conductive cylinders are formed on a surface of the conductive layer; a dielectric layer is formed on the surface of the conductive layer with the conductive cylinders; the tips of the conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer; removing the exposed tips of the conductive cylinders such that the height of the conductive cylinders is lower than the height of the dielectric layer, and the conductive cylinders sunk into the dielectric layer.
Claims15
A method for fabricating a circuit board structure with concave conductive cylinders, comprising:
- providing a conductive layer;
- forming a plurality of conductive cylinders on a surface of the conductive layer;
- forming a dielectric layer on the surface of the conductive layer;
- exposing the tips of the conductive cylinders on a surface of the dielectric layer far away from the conductive layer;
- and
- removing the exposed tips of the conductive cylinders, so that the height of the conductive cylinders is relatively lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer.
A method for fabricating a circuit board structure with concave conductive cylinders, comprises:
- providing a conductive layer;
- forming a dielectric layer on a surface of the conductive layer;
- forming a plurality of vias in the dielectric layer, wherein the vias expose the surface of the conductive layer;
- filling a conductive material in the vias to form a plurality of conductive cylinders on the surface of the conductive layer, so that the tips of these conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer;
- and
- removing the exposed tips of the conductive cylinders, so that the height of the conductive cylinders is relatively lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer.
A circuit board structure with concave conductive cylinders, comprising:
- a conductive layer;
- a plurality of conductive cylinders, formed on a surface of the conductive layer, and electrically connected to the conductive layer;
- and
- a patterned dielectric layer, covering the surface of the conductive layer, wherein the tips of the conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer, and the height of the conductive cylinders is relatively lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer.
Dependencies are inferred from the claim text.