EMI compartment shielding structure and fabricating method thereof

A method of providing electromagnetic interference (EMI) compartment shielding for electronic elements, comprising:

• providing an electronic element mounting surface having a ground pad exposedly arranged thereon for mounting at least one electronic element;
• disposing an encapsulating member on the mounting surface covering the ground pad and encapsulating at least one electronic element mounted thereon, the encapsulating member having at least one peripheral surface;
• disposing a trench pattern in the encapsulating member to define at least two package compartments therein,
• wherein the depth of the trench is sufficient to at least partially expose the ground pad,
• wherein the terminal portions of the trench is arranged within the encapsulating member proximal yet without compromising the peripheral surface;
• disposing conductive material into the trench to at least cover the trench surface for forming a compartment structure,
• wherein the compartment structure electrically connects the ground pad;
• disposing notches respectively into the encapsulating member from the peripheral surface thereof corresponding to the location of the terminal portions of the trench to expose the compartment structure across the thickness of the encapsulating member;
• and
• disposing conformal shielding on the encapsulating member and establishing connection thereof with the compartment structure through the notches.