H01K 3/08
Manufacture of mounts or stems
H01K3/08 (Manufacture of mounts or stems) appears on 20 US grants and 19 published applications in this corpus.
Search patents in H01K- Granted patents
- 20
- Published applications
- 19
- Assignees
- 20
- Inventors
- 50
- Latest grant
- 24 May 2016
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 3 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 3 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 3 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 2 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Incandescent lamp24 May 2016US 9,349,581 B2Toshiba Lighting & Technology Corporation
- EMI compartment shielding structure and fabricating method thereof22 Sep 2015US 9,144,183 B2Universal Scientific Industrial (Shanghai) Co., Ltd.
- Conductive vias in a substrate7 Apr 2015US 8,999,179 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating circuit board structure with concave conductive cylinders26 Nov 2013US 8,590,147 B2Unimicron Technology Corp.
- Light source bodies for filament tubes and ARC tubes12 Oct 2010US 7,811,148 B2Halogen Technologies, Inc.
- Conductor element for a filament lamp24 Apr 2025US 2025/0132144 A1Signify Holding B. V.
- Incandescent Lamp1 Oct 2015US 2015/0279653 A1Toshiba Lighting & Technology Corporation
- Emi compartment shielding structure and fabricating method thereof5 Feb 2015US 2015/0036296 A1Universal Scientific Industrial (Shanghai) Co., Ltd.
- Conductive Vias In A Substrate7 Feb 2013US 2013/0034816 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Vibration resistant electric incandescent lamp and method for reducing vibration14 Apr 2011US 2011/0084589 A1General Electric Company
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000
- EMI compartment shielding structure and fabricating method thereof21US 9,144,183 B2Universal Scientific Industrial (Shanghai) Co., Ltd. · 2015
- Method of supporting an electrical circuit on an electrically insulative base substrate10US 5,878,487 AFord Motor Company · 1999
- Light source bodies for filament tubes and ARC tubes9US 7,811,148 B2Halogen Technologies, Inc. · 2010