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US 2013/0034816 A1Published application
Conductive Vias In A Substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Der-Chyang Yeh
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Abstract
A method of forming a conductive via in a substrate includes forming a via hole covered by a dielectric layer followed by an annealing process. The dielectric layer can getter the mobile ions from the substrate. After removing the dielectric layer, a conductive material is formed in the via hole, forming a conductive via in the substrate.
Claims20
A method comprising:
- forming a via hole in a substrate, the via hole having a sidewall surface and a bottom surface;
- forming a dielectric layer on the substrate, the dielectric layer covering the sidewall surface and the bottom surface of the via hole;
- performing an annealing process on the dielectric layer;
- removing the dielectric layer;
- and
- forming a conductive material in the via hole.
3 more elements
A method comprising:
- forming a via hole in a substrate, wherein the substrate comprises mobile ions;
- forming a dielectric layer on sidewalls and bottom surfaces of the via holes;
- removing at least one of the mobile ions from the substrate;
- and
- removing the dielectric layer.
2 more elements
Dependencies are inferred from the claim text.