H01H 2085/0283
Structural association with a semiconductor device
Official title: {Structural association with a semiconductor device}
H01H2085/0283 (Structural association with a semiconductor device) appears on 86 US grants and 105 published applications in this corpus.
Search patents in H01H- Granted patents
- 86
- Published applications
- 105
- Assignees
- 70
- Inventors
- 197
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 3 | 2 |
| 2004 | 2 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 3 |
| 2008 | 1 | 0 |
| 2009 | 2 | 1 |
| 2010 | 0 | 3 |
| 2011 | 1 | 3 |
| 2012 | 3 | 1 |
| 2013 | 2 | 5 |
| 2014 | 2 | 2 |
| 2015 | 1 | 4 |
| 2016 | 5 | 4 |
| 2017 | 2 | 11 |
| 2018 | 8 | 4 |
| 2019 | 5 | 7 |
| 2020 | 8 | 9 |
| 2021 | 4 | 8 |
| 2022 | 8 | 11 |
| 2023 | 7 | 7 |
| 2024 | 9 | 8 |
| 2025 | 6 | 6 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power component and system with the power component25 Aug 2026US 12,716,963 B2ABB Schweiz AG
- Packages with electrical fuses10 Feb 2026US 12,548,727 B2Texas Instruments Incorporated
- In-vehicle device28 Oct 2025US 12,454,234 B2Autonetworks Technologies, Ltd.
- Method for fabricating semiconductor device with fuse structure19 Aug 2025US 12,394,709 B2Nanya Technology Corporation
- Devices and methods for programming a fuse29 Jul 2025US 12,374,517 B2Skyworks Solutions, Inc.
- Protecting device27 Aug 2026US 2026/0253829 A1Dexerials Corporation
- Resetable solid-state fuse13 Aug 2026US 2026/0237584 A1Kyocera AVX Components (Salzburg) GmbH
- Packages with electrical fuses25 Jun 2026US 2026/0179869 A1
- Circuit protection with solid-state device bypass and fuse11 Jun 2026US 2026/0163354 A1Sensata Technologies, Inc.
- Isolation device with safety fuse21 Aug 2025US 2025/0267883 A1
Most cited
By later US patents
- High voltage, high current switching apparatus61US 5,536,980 ATexas Instruments Incorporated · 1996
- Integral fuse for use in semiconductor packages30US 6,507,264 B1Littelfuse, Inc. · 2003
- Semiconductor device having overload protection20US 4,635,091 AU. S. Philips Corporation · 1987
- Semiconductor device with fuse function11US 5,068,706 AKabushiki Kaisha Toshiba · 1991
- Electrical device with integrally fused conductor11US 8,289,123 B2Littelfuse, Inc. · 2012