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US 12,548,727 B2Granted
Packages with electrical fuses
AssigneeTexas Instruments Incorporated
InventorsMahmud Halim Chowdhury, Amin Sijelmassi, Murali Kittappa, Anindya Poddar, Honglin Guo, Joe Adam Garcia, John Paul Tellkamp
Life of this patent
Estimating the term…
Abstract
In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.
Claims15
A quad flat no lead (QFN) package, comprising:
- a semiconductor die including a bond pad;
- an electrical fuse comprising:
- a conductive ball on the bond pad;
- and
- a bond wire including a first end coupled to the conductive ball and a second end ball bonded to a conductive terminal;
- and
- mold compound covering the electrical fuse, the semiconductor die, and the conductive terminal.
4 more elements
A semiconductor package, comprising:
- a semiconductor die including a bond pad;
- a conductive terminal including a portion exposed to an exterior of the package;
- and
- an electrical fuse comprising:
- a conductive ball on the bond pad;
- and
- a bond wire ball bonded to the conductive terminal, and the bond wire stitch-bonded to the conductive ball.
4 more elements
Dependencies are inferred from the claim text.