H01G 4/1209
Characterised by the ceramic dielectric material
Official title: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)}
H01G4/1209 (Characterised by the ceramic dielectric material) appears on 3,324 US grants and 3,805 published applications in this corpus.
Search patents in H01G- Granted patents
- 3,324
- Published applications
- 3,805
- Assignees
- 462
- Inventors
- 4,228
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 5 | 0 |
| 1978 | 8 | 0 |
| 1979 | 2 | 0 |
| 1980 | 7 | 0 |
| 1981 | 9 | 0 |
| 1982 | 5 | 0 |
| 1983 | 10 | 0 |
| 1984 | 13 | 0 |
| 1985 | 17 | 0 |
| 1986 | 27 | 0 |
| 1987 | 21 | 0 |
| 1988 | 15 | 0 |
| 1989 | 14 | 0 |
| 1990 | 7 | 0 |
| 1991 | 29 | 0 |
| 1992 | 23 | 0 |
| 1993 | 17 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 11 | 0 |
| 1997 | 16 | 0 |
| 1998 | 25 | 0 |
| 1999 | 22 | 0 |
| 2000 | 23 | 0 |
| 2001 | 37 | 23 |
| 2002 | 42 | 31 |
| 2003 | 47 | 47 |
| 2004 | 39 | 58 |
| 2005 | 40 | 40 |
| 2006 | 31 | 75 |
| 2007 | 41 | 88 |
| 2008 | 44 | 82 |
| 2009 | 49 | 84 |
| 2010 | 66 | 88 |
| 2011 | 47 | 80 |
| 2012 | 72 | 68 |
| 2013 | 71 | 88 |
| 2014 | 54 | 85 |
| 2015 | 88 | 114 |
| 2016 | 100 | 131 |
| 2017 | 121 | 156 |
| 2018 | 131 | 162 |
| 2019 | 186 | 220 |
| 2020 | 210 | 297 |
| 2021 | 214 | 277 |
| 2022 | 241 | 313 |
| 2023 | 303 | 354 |
| 2024 | 269 | 282 |
| 2025 | 273 | 289 |
| 2026 | 159 | 273 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer ceramic electronic device and dielectric ceramic composition6 Oct 2026US 12,755,901 B2Taiyo Yuden Co., Ltd.
- Dielectric material and device and memory device comprising the same6 Oct 2026US 12,757,417 B2Samsung Electronics Co., Ltd.
- Multilayer ceramic capacitor29 Sep 2026US 12,749,627 B2Murata Manufacturing Co., Ltd.
- Dielectric ceramic composition and multilayer ceramic electronic device22 Sep 2026US 12,741,911 B2Taiyo Yuden Co., Ltd.
- Multilayer electronic component22 Sep 2026US 12,744,156 B2Samsung Electro-Mechanics Co., Ltd.
- Dielectric composition with high-temperature stability8 Oct 2026US 2026/0308067 A1Amotech Co., Ltd.
- Multilayer electronic component8 Oct 2026US 2026/0311932 A1Samsung Electro-Mechanics Co., Ltd.
- Dielectric ceramic, method of preparing the same, and multilayer ceramic capacitor including the same8 Oct 2026US 2026/0311933 A1Samsung Electro-Mechanics Co., Ltd.
- Dielectric ceramic composition and multilayer ceramic electronic device1 Oct 2026US 2026/0296979 A1TDK Corporation
- Multilayer ceramic capacitor1 Oct 2026US 2026/0302063 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method for manufacturing a polycrystalline dielectric layer521US 8,667,654 B2STMicroelectronics (Crolles 2) SAS · 2014
- Method of manufacturing capacitive insulating film for capacitor449US 8,198,168 B2Elpida Memory, Inc. · 2012
- Tunable dielectric compositions including low loss glass184US 6,905,989 B2Paratek Microwave, Inc. · 2005
- Composite nanoparticle materials and method of making the same118US 7,052,777 B2Nanophase Technologies Corporation · 2006
- Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries116US 7,033,406 B2EEStor, Inc. · 2006