H01F 17/0033
With the coil helically wound around a magnetic core
Official title: {with the coil helically wound around a magnetic core}
H01F17/0033 (With the coil helically wound around a magnetic core) appears on 747 US grants and 820 published applications in this corpus.
Search patents in H01F- Granted patents
- 747
- Published applications
- 820
- Assignees
- 253
- Inventors
- 1,523
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 12 | 0 |
| 2001 | 12 | 7 |
| 2002 | 17 | 35 |
| 2003 | 25 | 28 |
| 2004 | 30 | 35 |
| 2005 | 32 | 27 |
| 2006 | 27 | 26 |
| 2007 | 33 | 36 |
| 2008 | 16 | 22 |
| 2009 | 21 | 28 |
| 2010 | 19 | 22 |
| 2011 | 24 | 14 |
| 2012 | 15 | 23 |
| 2013 | 16 | 42 |
| 2014 | 22 | 41 |
| 2015 | 20 | 35 |
| 2016 | 32 | 56 |
| 2017 | 26 | 32 |
| 2018 | 29 | 58 |
| 2019 | 49 | 58 |
| 2020 | 39 | 28 |
| 2021 | 40 | 32 |
| 2022 | 39 | 26 |
| 2023 | 26 | 36 |
| 2024 | 33 | 28 |
| 2025 | 22 | 19 |
| 2026 | 19 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Isolator29 Sep 2026US 12,749,787 B2Kabushiki Kaisha Toshiba
- Device having an in-substrate inductor and method for making the inductor25 Aug 2026US 12,720,774 B2QUALCOMM Incorporated
- Manufacturing method of magnetic element4 Aug 2026US 12,700,533 B2Delta Electronics (Shanghai) Co., Ltd.
- Microelectronic assemblies with inductors in direct bonding regions4 Aug 2026US 12,701,724 B2Intel Corporation
- Coil component2 Jun 2026US 12,646,649 B2TDK Corporation
- Patterned Magnetic Flux Structures and Applications20 Aug 2026US 2026/0245778 A1NVIDIA Corporation
- Integrated current sensor and energy harvester based on microresonator energy transducer20 Aug 2026US 2026/0245779 A1Schneider Electric USA, Inc.
- Patterned Magnetic Flux Structures and Applications20 Aug 2026US 2026/0245780 A1NVIDIA Corporation
- Inductor wiring structure and magnetic component6 Aug 2026US 2026/0229399 A1Lite-On Technology Corporation
- Inductor component, manufacturing method for inductor component, and substrate for inductor component manufacturing16 Jul 2026US 2026/0204469 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- High frequency chip packages with connecting elements238US 7,176,506 B2Tessera, Inc. · 2007
- Inductive structures for semiconductor integrated circuits217US 5,095,357 AMitsubishi Denki Kabushiki Kaisha · 1992
- Plastic quad-packaged switched-mode integrated circuit with integrated transformer windings and mouldings for transformer core pieces211US 5,469,334 APower Integrations, Inc. · 1995
- Integrated circuit toroidal inductor182US 5,793,272 AInternational Business Machines Corporation · 1998
- Integrated circuit inductor175US 5,884,990 AInternational Business Machines Corporation · 1999