Inductor component, manufacturing method for inductor component, and substrate for inductor component manufacturing

A manufacturing method for an inductor component, comprising:

• forming a seed layer having conductivity over a main surface of a base substrate;
• forming, on the seed layer, an insulating layer having an opening of a predetermined wiring pattern;
• forming a resin wall on the insulating layer along an outer edge of the opening;
• forming an inductor wiring line by forming, by electrolytic plating performed by supplying power to the seed layer, a wiring body in a space surrounded by the resin wall and monolithically forming, in the opening, a protruding portion that protrudes from the wiring body and extends along the wiring body;
• forming a magnetic layer including a magnetic material around the wiring body and the protruding portion after the forming an inductor wiring line;
• forming an element body;
• and
• removing the seed layer after the forming an element body.

A substrate for inductor component manufacturing, comprising:

• a base substrate;
• a seed layer that is over a main surface of the base substrate and has conductivity;
• an insulating layer that is on the seed layer and is parallel to the main surface of the base substrate;
• and
• an inductor wiring line that is on the insulating layer and extends in parallel with the main surface of the base substrate, wherein when one of directions orthogonal to the main surface of the base substrate is defined as a positive direction and a direction opposite to the positive direction is defined as a negative direction,
• the inductor wiring line includes
• a wiring body that extends on an outer surface of the insulating layer on the positive direction side, and
• a protruding portion that protrudes toward the negative direction side from an outer surface of the wiring body on the negative direction side,
• when viewed in the positive direction, the protruding portion extends along the wiring body, and
• a surface of the protruding portion on the negative direction side is in contact with the seed layer.