H01C 17/24
By removing or adding resistive material
Official title: by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)
H01C17/24 (By removing or adding resistive material) appears on 336 US grants and 261 published applications in this corpus.
Search patents in H01C- Granted patents
- 336
- Published applications
- 261
- Assignees
- 187
- Inventors
- 676
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 8 | 0 |
| 1993 | 8 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 11 | 0 |
| 2000 | 8 | 0 |
| 2001 | 17 | 1 |
| 2002 | 8 | 9 |
| 2003 | 9 | 14 |
| 2004 | 5 | 24 |
| 2005 | 12 | 15 |
| 2006 | 11 | 17 |
| 2007 | 8 | 15 |
| 2008 | 8 | 8 |
| 2009 | 2 | 6 |
| 2010 | 7 | 7 |
| 2011 | 4 | 5 |
| 2012 | 5 | 4 |
| 2013 | 2 | 6 |
| 2014 | 6 | 6 |
| 2015 | 5 | 9 |
| 2016 | 8 | 13 |
| 2017 | 6 | 18 |
| 2018 | 14 | 12 |
| 2019 | 21 | 10 |
| 2020 | 13 | 9 |
| 2021 | 10 | 7 |
| 2022 | 5 | 10 |
| 2023 | 8 | 9 |
| 2024 | 7 | 7 |
| 2025 | 4 | 11 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Thin film resistor11 Aug 2026US 12,707,657 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Thermistor integrated with a bias resistor30 Jun 2026US 12,671,018 B2Texas Instruments Incorporated
- Resistor3 Feb 2026US 12,542,226 B2Rohm Co., Ltd.
- Wiring substrate and method for manufacturing wiring substrate13 Jan 2026US 12,526,918 B2Niterra Co., Ltd.
- Method for confectioning resistors, resistor, and heating device16 Sep 2025US 12,417,866 B2BorgWarner Inc.
- Chip resistor23 Jul 2026US 2026/0213049 A1Panasonic Intellectual Property Management Co., Ltd.
- Resistor and method for manufacturing the resistor25 Jun 2026US 2026/0179811 A1Panasonic Intellectual Property Management Co., Ltd.
- Flattening resistor and manufacture method thereof11 Jun 2026US 2026/0162857 A1Viking Tech Corporation
- Columnar resistor and method of laser trimming for manufacturing the same11 Jun 2026US 2026/0162858 A1Viking Tech Corporation
- Electronic component, manufacturing method thereof, and thin-film resistor21 May 2026US 2026/0142063 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Compound switching matrix for probing and interconnecting devices under test to measurement equipment152US 6,100,815 AElectro Scientific Industries, Inc. · 2000
- Pulse control in laser systems95US 6,339,604 B12002
- Method and system for calibrating a laser processing system and laser marking system utilizing same85US 7,015,418 B2GSI Group Corporation · 2006
- Tape element and methods, for heating, pressure measurement and circuit fabrication55US 4,823,106 ATapeswitch Corporation of America · 1989
- Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors53US 6,259,151 B1Intersil Corporation · 2001