H01C 1/034
The housing or enclosure being formed as coating or mould without outer
Official title: the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence)
H01C1/034 (The housing or enclosure being formed as coating or mould without outer) appears on 111 US grants and 58 published applications in this corpus.
Search patents in H01C- Granted patents
- 111
- Published applications
- 58
- Assignees
- 66
- Inventors
- 249
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 1 |
| 2008 | 1 | 4 |
| 2009 | 2 | 0 |
| 2010 | 0 | 1 |
| 2011 | 2 | 3 |
| 2012 | 4 | 3 |
| 2013 | 3 | 1 |
| 2014 | 1 | 1 |
| 2015 | 1 | 2 |
| 2016 | 0 | 4 |
| 2017 | 2 | 0 |
| 2018 | 3 | 2 |
| 2019 | 3 | 8 |
| 2020 | 5 | 4 |
| 2021 | 0 | 3 |
| 2022 | 5 | 3 |
| 2023 | 2 | 4 |
| 2024 | 4 | 4 |
| 2025 | 2 | 6 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Overcurrent protection element26 May 2026US 12,640,291 B2Thinking Electronic Industrial Co., Ltd.
- Metal oxide-polyaniline polymer matrix varistor12 May 2026US 12,626,842 B2Littelfuse, Inc.
- Resistor18 Nov 2025US 12,476,029 B2Proterial, Ltd.
- Resistor and manufacturing method of resistor11 Mar 2025US 12,249,448 B2Koa Corporation
- Electronic component31 Dec 2024US 12,183,488 B2Rohm Co., Ltd.
- Electronic component and method for manufacturing same25 Dec 2025US 2025/0391593 A1Panasonic Intellectual Property Management Co., Ltd.
- Three-dimensional electrodes for reflowable ptc device30 Oct 2025US 2025/0336576 A1Littelfuse, Inc.
- Electronic component and film forming method8 May 2025US 2025/0149209 A1Murata Manufacturing Co., Ltd.
- Electronic component and method for manufacturing electronic component10 Apr 2025US 2025/0118461 A1Murata Manufacturing Co., Ltd.
- Electronic component20 Mar 2025US 2025/0095885 A1Rohm Co., Ltd.
Most cited
By later US patents
- Fiber/resin composites, and method of making the same75US 4,892,764 ALoctite Corporation · 1990
- Thermistor51US 5,534,843 AMitsubishi Materials Corporation · 1996
- Thin-film microcircuits adapted for laser trimming38US 4,217,570 ATektronix, Inc. · 1980
- Electrical resistor34US 4,529,958 ADale Electronics, Inc. · 1985
- Passivated thin-film hybrid circuits30US 4,288,776 ATektronix, Inc. · 1981