Electronic component and film forming method
AssigneeMurata Manufacturing Co., Ltd.
InventorsMitsuru NAKANO, Hiroshi SHIRAKI
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Abstract
An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 μm or more and 2.0 μm or less. The interval between the particles is 1.3 μm or less.
Claims15
An electronic component comprising:
- a base body;
- and
- an alumina film covering an outer surface of the base body, wherein
- the alumina film includes:
- a film-shaped part made of alumina and being in contact with the outer surface of the base body;
- and a particle layer located on a side closer to an outer surface of the film-shaped part,
- the particle layer includes a plurality of particles made of alumina, the plurality of particles being bonded to an outer surface of the film-shaped part,
- the alumina film including the film-shaped part and the particle layer has an average value of thicknesses of 0.05 μm or more and 2.0 μm or less inclusive, and
- the particles have an interval of 1.3 μm or less.
A film forming method for forming an alumina film on an outer surface of a base body, the film forming method comprising:
- charging the base body into a first chamber that is capable of heating an internal atmosphere;
- misting a raw material that is liquid and contains an aluminum atom and an oxygen atom into mist with an ultrasonic wave in a second chamber;
- supplying the misted raw material from an inside of the second chamber into the first chamber together with a carrier gas;
- and
- heating an inside of the first chamber to a first temperature while performing the supplying the misted raw material, and further second heating the inside of the first chamber to a second temperature defined as a temperature lower than the first temperature while performing the supply step after the first heating step.
A film forming method for forming an alumina film on an outer surface of a base body, the film forming method comprising:
- charging the base body into a first chamber that is capable of heating an internal atmosphere;
- forming a raw material that is liquid and contains an aluminum atom and an oxygen atom into mist with a first ultrasonic wave with first frequency in a second chamber;
- forming a raw material that is liquid and contains an aluminum atom and an oxygen atom into mist with a second ultrasonic wave with second frequency in a second chamber;
- supplying the misted raw material from an inside of the second chamber into the first chamber together with a carrier gas;
- and
- heating an inside of the first chamber.
Dependencies are inferred from the claim text.