Passivated thin-film hybrid circuits
AssigneeTektronix, Inc.
InventorRobert E. Holmes
Life of this patent
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Abstract
Thin-film microcircuit structures passivated with silicon nitride are provided in which included electrical components containing nickel, chromium or other nitride-forming metals are encapsulated in an oxide material, preferably silicon oxide. The metal-containing components are thus prevented from reacting with the silicon nitride passivation coating during through-passivation laser trimming of the components.
Claims10
A method for manufacturing a thin-film electrical microcircuit structure containing a laser-trimmed circuit element, which structure includes an unfractured silicon nitride passivation layer, comprising the subsequential steps of:
- (a) forming a first layer of an insulating oxide on a substrate,
- (b) forming a thin-film electrical circuit element on the first oxide layer, said element being formed from a material containing a metal capable of reacting with silicon nitride at the temperature produced by laser trimming of the element to form a metal nitride having a dissociation temperature no higher than the first-mentioned temperature,
- (c) forming a second layer of an insulating oxide over the circuit element and adjacent portions of the first oxide layer,
- (d) depositing a layer of silicon nitride over the exposed surface of said second layer, and
- (e) trimming the thin-film circuit element to a desired value by removing portions of the element with a laser beam directed through said silicon nitride layer and second oxide layer.
A microcircuit structure comprising
- a substrate having a first layer of an insulating oxide on a surface thereof, said layer having a minimum average thickness of about 1,000 angstroms,
- a thin-film electrical component disposed on said first oxide layer, said component being formed from a material containing a metal capable of reacting with silicon nitride at the temperature produced by laser trimming of the component to form a metal nitride having a dissociation temperature no higher than the first-mentioned temperature, and
- an unfractured protective coating covering said component and adjoining surface areas of the first oxide layer, said coating including a second layer of an oxide deposited to a minimum average thickness of about 1,000 angstroms on said component's and the first oxide layer's surface areas, and an overlying layer of silicon nitride,
- said structure including a relatively high resistance region within the portions of said oxide layers that adjoin said component, said region being formed by laser trimming of the component through said protective coating and containing a stable reaction product of said metal with the material forming said oxide layers.
Dependencies are inferred from the claim text.