Electronic component
AssigneeRohm Co., Ltd.
InventorBungo Tanaka
Life of this patent
Estimating the term…
Abstract
An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.
Claims18
An electronic component comprising:
- a first insulating layer that includes impurities;
- a thin film resistor formed on the first insulating layer;
- and
- a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities, wherein
- the first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface,
- the barrier layer is embedded in the concave portion, and
- the barrier layer includes a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.
An electronic component comprising:
- a first insulating layer that includes impurities;
- a thin film resistor formed on the first insulating layer;
- and
- a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities, wherein
- the first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface,
- the barrier layer is embedded in the concave portion, and the concave portion has a bottom surface and an inclined surface that connects the bottom surface and the first surface together.
An electronic component comprising:
- a first insulating layer that includes impurities;
- a thin film resistor formed on the first insulating layer;
- and
- a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities, wherein the impurities include Ar.
Dependencies are inferred from the claim text.