H01C 1/02
Housing
Official title: Housing; Enclosing; Embedding; Filling the housing or enclosure
H01C1/02 (Housing) appears on 535 US grants and 454 published applications in this corpus.
Search patents in H01C- Granted patents
- 535
- Published applications
- 454
- Assignees
- 300
- Inventors
- 1,322
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 7 | 0 |
| 1979 | 8 | 0 |
| 1980 | 8 | 0 |
| 1981 | 12 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 9 | 0 |
| 1988 | 5 | 0 |
| 1989 | 8 | 0 |
| 1990 | 12 | 0 |
| 1991 | 12 | 0 |
| 1992 | 8 | 0 |
| 1993 | 11 | 0 |
| 1994 | 12 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 11 | 0 |
| 1999 | 11 | 0 |
| 2000 | 7 | 0 |
| 2001 | 14 | 3 |
| 2002 | 8 | 12 |
| 2003 | 9 | 7 |
| 2004 | 3 | 10 |
| 2005 | 7 | 12 |
| 2006 | 7 | 10 |
| 2007 | 4 | 10 |
| 2008 | 5 | 14 |
| 2009 | 7 | 5 |
| 2010 | 2 | 12 |
| 2011 | 9 | 7 |
| 2012 | 12 | 12 |
| 2013 | 10 | 12 |
| 2014 | 7 | 17 |
| 2015 | 5 | 12 |
| 2016 | 18 | 15 |
| 2017 | 13 | 27 |
| 2018 | 26 | 24 |
| 2019 | 29 | 26 |
| 2020 | 30 | 32 |
| 2021 | 19 | 40 |
| 2022 | 26 | 27 |
| 2023 | 29 | 24 |
| 2024 | 17 | 29 |
| 2025 | 21 | 33 |
| 2026 | 8 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01C 1/028The resistive element being embedded in insulation with outer enclosing sheath166
- H01C 1/034The housing or enclosure being formed as coating or mould without outer111
- H01C 1/022The housing or enclosure being openable or separable from the resistive element74
- H01C 1/024The housing or enclosure being hermetically sealed59
- H01C 1/032Plural layers surrounding the resistive element47
Recent patents
- Vacuum valve and method for manufacturing same21 Jul 2026US 12,688,956 B2Mitsubishi Electric Corporation
- Thermal-protective transient voltage suppressor (TVS)30 Jun 2026US 12,671,017 B2Xiamen Set Electronics Co., Ltd
- Chip resistor23 Jun 2026US 12,665,109 B2Rohm Co., Ltd.
- Overcurrent protection element26 May 2026US 12,640,291 B2Thinking Electronic Industrial Co., Ltd.
- Metal oxide-polyaniline polymer matrix varistor12 May 2026US 12,626,842 B2Littelfuse, Inc.
- Ceramic component1 Oct 2026US 2026/0302068 A1Panasonic Intellectual Property Management Co., Ltd.
- Metal plate resistor and method for manufacturing metal plate resistor24 Sep 2026US 2026/0290657 A1Koa Corporation
- Resistance unit, resistance assembly, and battery pack24 Sep 2026US 2026/0290658 A1LG Energy Solution, Ltd.
- Resistor17 Sep 2026US 2026/0279621 A1SEMITEC Corporation
- Thin film resistor and method of forming the same17 Sep 2026US 2026/0279623 A1Yageo Corporation
Most cited
By later US patents
- Method of forming thin film resistors on organic surfaces105US 5,849,623 AGeneral Electric Company · 1998
- Thin film resistors on organic surfaces92US 5,675,310 AGeneral Electric Company · 1997
- Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts86US 7,470,999 B2Nippon Electric Glass Co., Ltd. · 2008
- Photopolymerizable compositions used in electronics79US 5,180,757 A1993
- Fiber/resin composites, and method of making the same75US 4,892,764 ALoctite Corporation · 1990