H01C 1/028
The resistive element being embedded in insulation with outer enclosing sheath
Official title: the resistive element being embedded in insulation with outer enclosing sheath
H01C1/028 (The resistive element being embedded in insulation with outer enclosing sheath) appears on 166 US grants and 193 published applications in this corpus.
Search patents in H01C- Granted patents
- 166
- Published applications
- 193
- Assignees
- 122
- Inventors
- 499
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 4 |
| 2003 | 5 | 4 |
| 2004 | 2 | 7 |
| 2005 | 5 | 8 |
| 2006 | 4 | 3 |
| 2007 | 2 | 6 |
| 2008 | 2 | 5 |
| 2009 | 2 | 2 |
| 2010 | 0 | 5 |
| 2011 | 1 | 2 |
| 2012 | 5 | 6 |
| 2013 | 4 | 2 |
| 2014 | 1 | 7 |
| 2015 | 2 | 4 |
| 2016 | 6 | 4 |
| 2017 | 4 | 8 |
| 2018 | 7 | 13 |
| 2019 | 11 | 7 |
| 2020 | 8 | 11 |
| 2021 | 11 | 19 |
| 2022 | 11 | 20 |
| 2023 | 19 | 11 |
| 2024 | 9 | 15 |
| 2025 | 12 | 11 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for improving anti-reduction performance of PTC thermosensitive element14 Apr 2026US 12,603,199 B2Jiangsu New Linzhi Electronic Technology Co., Ltd.
- Sensor arrangement and method for producing a sensor arrangement24 Feb 2026US 12,560,489 B2TDK Electronics Co., Ltd.
- Resistor3 Feb 2026US 12,542,226 B2Rohm Co., Ltd.
- Temperature sensor element and method for manufacturing temperature sensor element25 Nov 2025US 12,480,820 B2Shibaura Electronics Co., Ltd.
- Surge arrester25 Nov 2025US 12,482,585 B2Hitachi Energy Ltd
- Resistor17 Sep 2026US 2026/0279621 A1SEMITEC Corporation
- Chip resistor9 Jul 2026US 2026/0196389 A1Koa Corporation
- Method for manufacturing filaments for use in pirani gauges as well as pirani gauge with such a filament21 May 2026US 2026/0142062 A1Inficon GmbH
- Method for applying a coating to at least one electronic component and coating arrangement19 Mar 2026US 2026/0077376 A1TDK Electronics Co., Ltd.
- Electronic component12 Feb 2026US 2026/0045389 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts86US 7,470,999 B2Nippon Electric Glass Co., Ltd. · 2008
- Electric motor protector sensor51US 5,367,282 ATexas Instruments Incorporated · 1994
- Method for manufacturing surface mount conductive polymer devices47US 5,802,709 ABourns Multifuse (Hong Kong) Ltd. · 1998
- Temperature sensor44US 6,639,505 B2Denso Corporation · 2003
- Expandable multi-segment band heater construction with improved electrical connection32US 5,667,712 AWatlow Electric Manufacturing Company · 1997