Sensor arrangement and method for producing a sensor arrangement
AssigneeTDK Electronics Co., Ltd.
InventorsAbraham Kho, Guido Mauthe, Andi Permana
Life of this patent
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Abstract
In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.
Claims19
A sensor arrangement comprising:
- a ceramic-based substrate;
- at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material;
- at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material;
- and
- an insulating body enveloping the sensor chip and at least parts of the first and second contact elements, wherein the substrate is mainly free from a material of the insulating body,
- wherein the material of the insulating body is arranged directly on at least parts of an upper surface of the substrate,
- wherein side surfaces and a lower surface of the substrate are free from the material of the insulating body,
- wherein the contact member is configured to reduce mechanical stress between the first contact element and the sensor chip, and
- wherein a respective contact element comprises a U-shaped spring member, or
- wherein the respective contact element comprises a first contact area, which is free from the material of the insulating body, wherein the first contact areas function as the outer electrodes, and wherein the first contact area is formed by one of two legs of a respective U-shaped spring member.
A method for producing a sensor arrangement, the method comprising:
- providing a ceramic-based substrate and arranging a plurality of metallized pads on an upper surface of the substrate;
- providing a first portion of a bonding material;
- providing a plurality of sensor chips, wherein a respective sensor chip comprises electrodes arranged on an upper side and on an under side of the sensor chip;
- reflow soldering to electrically connect one of the electrodes of the respective sensor chip with the substrate such that the respective sensor chip is arranged on the substrate in a horizontal position;
- providing a second portion of the bonding material;
- providing a plurality of first and second contact elements, wherein a respective contact element comprises a first contact area and a second contact area, and wherein each first contact element comprises a contact member;
- reflow soldering to electrically connect the second contact areas with the metallized pads and the contact members with another one of the electrodes of the sensor chip;
- packaging;
- and
- singulating.
A sensor arrangement comprising:
- a ceramic-based substrate;
- at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material;
- at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material;
- and
- an insulating body enveloping the sensor chip and at least parts of the first and second contact elements, wherein the substrate is mainly free from a material of the insulating body,
- wherein a respective contact element comprises a U-shaped spring member,
- wherein the respective contact element comprises a first contact area, which is free from the material of the insulating body, and
- wherein the respective contact element comprises a second contact area, which is completely arranged within the insulating body, wherein the second contact areas are bonded to metallized pads of the substrate to establish an electrical contact between the first and second contact elements and the substrate.
Dependencies are inferred from the claim text.