US 5,802,709 A · Method for manufacturing surface mount conductive polymer devices

Abstract

A conductive polymer device includes an active element comprising a conductive polymeric layer laminated between a pair of electrodes to which terminal leads are attached. The active element is enclosed in an insulative package. Each of the electrodes may be formed integrally with its associated terminal lead in a single lead frame, with a layer of conductive polymeric material laminated between two such lead frames. Alternatively, a conductive polymeric layer may be laminated between two electrodes, with a terminal lead then being soldered to each electrode. The insulative package for the active element may be either an over-molded housing encasing the active element, or a pre-molded housing having a cavity into which the active element is installed, and which is then hermetically sealed with a suitable sealant material.

Claims15

Dependent claims

A method of making an electronic device, comprising the steps of:

providing a first length of conductive metal foil having a peripheral edge formed as a first carrier strip;
providing a second length of conductive metal foil having a peripheral edge formed as a second carrier strip;
laminating a layer of conductive polymeric material between the first and second lengths of conductive metal foil to form a laminated strip having the first and second carrier strips along opposed edges;
forming the laminated strip into a plurality of active elements, each comprising a layer of conductive polymer material sandwiched between a first planar metal foil electrode connected to the first carrier strip by a first terminal lead element and a second planar metal foil electrode connected to the second carrier strip by a second terminal lead element;
enclosing each of the active elements in an insulative package;
and
separating the first and second terminal lead elements from the first and second carrier strips, respectively.

4 more elements

Dependencies are inferred from the claim text.

Method for manufacturing surface mount conductive polymer devices

Life of this patent

Method for manufacturing surface mount conductive polymer devices

Life of this patent

Abstract

Claims15