H01C 1/032
Plural layers surrounding the resistive element
Official title: plural layers surrounding the resistive element (H01C1/028 takes precedence)
H01C1/032 (Plural layers surrounding the resistive element) appears on 47 US grants and 59 published applications in this corpus.
Search patents in H01C- Granted patents
- 47
- Published applications
- 59
- Assignees
- 34
- Inventors
- 142
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 3 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 3 |
| 2011 | 3 | 2 |
| 2012 | 2 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 7 |
| 2018 | 6 | 1 |
| 2019 | 3 | 3 |
| 2020 | 3 | 5 |
| 2021 | 1 | 3 |
| 2022 | 2 | 6 |
| 2023 | 4 | 4 |
| 2024 | 4 | 6 |
| 2025 | 2 | 4 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip resistor23 Jun 2026US 12,665,109 B2Rohm Co., Ltd.
- Resistor3 Feb 2026US 12,542,226 B2Rohm Co., Ltd.
- Temperature sensor element and method for manufacturing temperature sensor element25 Nov 2025US 12,480,820 B2Shibaura Electronics Co., Ltd.
- Resistor18 Nov 2025US 12,476,028 B2Rohm Co., Ltd.
- Electronic component31 Dec 2024US 12,183,488 B2Rohm Co., Ltd.
- Ceramic component1 Oct 2026US 2026/0302068 A1Panasonic Intellectual Property Management Co., Ltd.
- Thin film resistor and method of forming the same17 Sep 2026US 2026/0279623 A1Yageo Corporation
- Resistor and method for manufacturing the same10 Sep 2026US 2026/0269107 A1Yageo Corporation
- Electronic component27 Aug 2026US 2026/0253766 A1Panasonic Intellectual Property Management Co., Ltd.
- Chip resistor9 Jul 2026US 2026/0196389 A1Koa Corporation
Most cited
By later US patents
- Method of forming thin film resistors on organic surfaces105US 5,849,623 AGeneral Electric Company · 1998
- Thin film resistors on organic surfaces92US 5,675,310 AGeneral Electric Company · 1997
- Method for forming a thin-film resistor56US 6,272,736 B1United Microelectronics Corp. · 2001
- High voltage insulator for electrical components having telescoping insulative sleeves49US 4,481,380 AAlden Research Foundation · 1984
- Surface mountable over-current protecting device25US 6,377,467 B1Polytronics Technology Corp. · 2002