G06T 2207/30148
Semiconductor
Official title: Semiconductor; IC; Wafer
G06T2207/30148 (Semiconductor) appears on 3,198 US grants and 3,868 published applications in this corpus.
Search patents in G06T- Granted patents
- 3,198
- Published applications
- 3,868
- Assignees
- 745
- Inventors
- 6,765
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 9 | 0 |
| 1987 | 4 | 0 |
| 1988 | 9 | 0 |
| 1989 | 12 | 0 |
| 1990 | 14 | 0 |
| 1991 | 14 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 13 | 0 |
| 1996 | 8 | 0 |
| 1997 | 11 | 0 |
| 1998 | 16 | 0 |
| 1999 | 20 | 0 |
| 2000 | 30 | 0 |
| 2001 | 23 | 20 |
| 2002 | 36 | 62 |
| 2003 | 55 | 84 |
| 2004 | 45 | 85 |
| 2005 | 63 | 91 |
| 2006 | 88 | 95 |
| 2007 | 63 | 86 |
| 2008 | 77 | 93 |
| 2009 | 62 | 102 |
| 2010 | 81 | 87 |
| 2011 | 74 | 90 |
| 2012 | 113 | 85 |
| 2013 | 82 | 98 |
| 2014 | 76 | 103 |
| 2015 | 96 | 116 |
| 2016 | 97 | 117 |
| 2017 | 112 | 154 |
| 2018 | 131 | 145 |
| 2019 | 175 | 232 |
| 2020 | 212 | 210 |
| 2021 | 203 | 264 |
| 2022 | 181 | 329 |
| 2023 | 223 | 277 |
| 2024 | 194 | 271 |
| 2025 | 257 | 322 |
| 2026 | 188 | 250 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for identifying defects in materially integral connections6 Oct 2026US 12,754,144 B2Fraunhofer Gesselschaft zur Förderung der Angewandten Forschung e. V.
- Machine learning based defect examination for semiconductor specimens6 Oct 2026US 12,755,369 B2Applied Materials Israel Ltd.
- Substrate inspection method, recording medium, and substrate inspection device6 Oct 2026US 12,755,374 B2Tokyo Electron Limited
- Evaluation method, semiconductor device manufacturing method, and evaluation system6 Oct 2026US 12,755,375 B2Kioxia Corporation
- Substrate processing apparatus and substrate processing method6 Oct 2026US 12,757,674 B2Tokyo Electron Limited
- Inspection system for edge and bevel inspection of semiconductor structures8 Oct 2026US 2026/0309638 A1Camtek Ltd.
- Semiconductor process and device imaging and inspection8 Oct 2026US 2026/0311315 A1
- Method and apparatus for inspecting a wafer8 Oct 2026US 2026/0311320 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Active learning-based defect location identification8 Oct 2026US 2026/0311321 A1ASML Netherlands B. V.
- Dimension Measurement System, Estimation System, and Dimension Measurement Method8 Oct 2026US 2026/0311356 A1Hitachi High-Tech Corporation
Most cited
By later US patents
- Automated defect classification system281US 5,544,256 AInternational Business Machines Corporation · 1996
- Inspection technique of photomask263US 6,091,845 AMicron Technology, Inc. · 2000
- Feature-based defect detection256US 6,539,106 B1APPLIED Materials.Inc. · 2003
- Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems226US 4,805,123 AKLA Instruments Corporation · 1989
- Methods and systems for utilizing design data in combination with inspection data219US 7,570,796 B2KLA-Tencor Technologies Corporation · 2009