G05B 2219/32206
Selection from a lot of workpieces to be inspected
G05B2219/32206 (Selection from a lot of workpieces to be inspected) appears on 11 US grants and 17 published applications in this corpus.
Search patents in G05B- Granted patents
- 11
- Published applications
- 17
- Assignees
- 17
- Inventors
- 42
- Latest grant
- 21 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 2 |
| 2007 | 1 | 2 |
| 2008 | 3 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 3 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 2 |
| 2024 | 0 | 3 |
| 2025 | 2 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method and device for manufacturing a multiplicity of components with at least one electrical feedthrough and an information store, component, and method and device for the further processing of such components21 Oct 2025US 12,453,015 B2Schott AG
- Dynamic sampling method and device for semiconductor manufacture29 Jul 2025US 12,372,953 B2Winbond Electronics Corp.
- Graphical user interface for scheduling and monitoring an automated inspection process for batch production26 Sep 2023US 11,768,574 B2Hexagon Metrology, Inc.
- Automated inspection process for batch production31 May 2022US 11,347,368 B2Hexagon Metrology, Inc.
- Adaptive value capture for process monitoring27 Feb 2018US 9,905,483 B2Advantest Corporation
- Method and device for manufacturing a multiplicity of components with at least one electrical feedthrough and an information store, component, and method and device for the further processing of such components29 Jan 2026US 2026/0032829 A1Schott AG
- Method and System for Measuring Components and Program14 Mar 2024US 2024/0085890 A1Carl Zeiss Industrielle Messtechnik GmbH
- Method and device for optimizing an amount of testing with respect to a total test time15 Feb 2024US 2024/0055304 A1Robert Bosch GmbH
- Dynamic sampling method and device for semiconductor manufacture8 Feb 2024US 2024/0045408 A1Winbond Electronics Corp.
- Method and System for Automatically Characterizing a Workpiece During a Machining Process Using a Machine Tool28 Sep 2023US 2023/0305541 A1ZF Friedrichshafen AG
Most cited
By later US patents
- Dual-phase virtual metrology method11US 7,603,328 B2National Cheng Kung University · 2009
- Method and apparatus for selecting wafers for sampling9US 7,460,968 B1Advanced Micro Devices, Inc. · 2008
- Method and apparatus for inspecting semiconductor wafer4US 7,308,329 B2Olympus Corporation · 2007
- Graphical user interface for scheduling and monitoring an automated inspection process for batch production3US 11,768,574 B2Hexagon Metrology, Inc. · 2023
- Test data analyzing system and test data analyzing program2US 7,424,336 B2Hitachi High-Technologies Corporation · 2008