G05B 19/188
Characterised by special applications and not provided for in the relevant subclasses
Official title: {characterised by special applications and not provided for in the relevant subclasses, (e.g. making dies, filament winding)}
G05B19/188 (Characterised by special applications and not provided for in the relevant subclasses) appears on 119 US grants and 150 published applications in this corpus.
Search patents in G05B- Granted patents
- 119
- Published applications
- 150
- Assignees
- 107
- Inventors
- 399
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 0 |
| 2006 | 3 | 0 |
| 2007 | 0 | 5 |
| 2008 | 5 | 2 |
| 2009 | 0 | 3 |
| 2010 | 1 | 2 |
| 2011 | 1 | 1 |
| 2012 | 3 | 3 |
| 2013 | 1 | 2 |
| 2014 | 1 | 5 |
| 2015 | 2 | 8 |
| 2016 | 6 | 7 |
| 2017 | 2 | 3 |
| 2018 | 3 | 11 |
| 2019 | 9 | 12 |
| 2020 | 11 | 9 |
| 2021 | 9 | 8 |
| 2022 | 2 | 8 |
| 2023 | 8 | 17 |
| 2024 | 8 | 9 |
| 2025 | 15 | 18 |
| 2026 | 10 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for semiconductor fabricating process22 Sep 2026US 12,743,069 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electrical equipment management8 Sep 2026US 12,731,966 B2Schneider Electric USA, Inc.
- Radio frequency sensor calibration by virtual metrology1 Sep 2026US 12,724,395 B2Tokyo Electron Limited
- Measurement of inherent substrate distortion11 Aug 2026US 12,704,825 B2APPLIED Materials.Inc.
- Reinforcement learning (RL) based federated automated defect classification and detection4 Aug 2026US 12,699,387 B2Imec Vzw
- Processing Apparatus, Substrate Processing Apparatus, Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium1 Oct 2026US 2026/0299546 A1Kokusai Electric Corporation
- Apparatus and method for manufacturing semiconductor device and apparatus and method for setting processing conditions used in manufacturing the same24 Sep 2026US 2026/0288108 A1Kioxia Corporation
- System and Method for Adaptive Semiconductor Process Control17 Sep 2026US 2026/0277184 A1Qomplx LLC
- Stability of machining of thin-wall parts30 Jul 2026US 2026/0220325 A1Rtx Corporation
- Monitoring Stability of Semiconductor Manufacturing Process Systems Using Digital Twins and Neural Networks4 Jun 2026US 2026/0153850 A1Inspiring Atoms Pte Ltd
Most cited
By later US patents
- Liquid handling apparatus58US 4,422,151 A1983
- Systems and methods for controlling phasing of advancing substrates in absorbent article converting lines53US 8,145,344 B2The Procter & Gamble Company · 2012
- Cutting tool having variable movement in a z-direction laterally along a work piece for making microstructures48US 7,350,442 B23M Innovative Properties Company · 2008
- Multihead composite material application machine programming method and apparatus for manufacturing composite structures40US 7,376,480 B2The Boeing Company · 2008
- Profile stitching apparatus and method38US 4,221,176 AQuality Mills, Inc. · 1980