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US 2026/0288108 A1Published application
Apparatus and method for manufacturing semiconductor device and apparatus and method for setting processing conditions used in manufacturing the same
AssigneeKioxia Corporation
InventorYuta MANABE
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Abstract
A method for manufacturing a semiconductor device employs a condition setting method that includes sequentially shifting a step of interest among multiple steps of substrate processing from a first step to a last step; and at each step of interest, determining a processing condition for optimizing a processed shape during the step of interest, and using the determined processing condition as a beginning processing condition in another step of the multiple steps.
Claims20
A condition setting method comprising
- sequentially shifting a step of interest among multiple steps of substrate processing from a first step to a last step;
- and
- at each step of interest, determining a processing condition for optimizing a processed shape during the step of interest, and using the determined processing condition as a beginning processing condition in another step of the multiple steps.
A condition setting device comprising:
- a storage unit configured to store a temporary processing condition for each of steps of substrate processing having multiple steps;
- and
- a control unit configured to:
- sequentially shift a step of interest among the multiple steps of substrate processing from a first step to a last step;
- and
- at each step of interest, determining a processing condition for optimizing a processed shape during the step of interest, and using the determined processing condition as a beginning processing condition in another step of the multiple steps.
3 more elements
Dependencies are inferred from the claim text.