Measurement of inherent substrate distortion
AssigneeApplied Materials, Inc.
InventorsPiyush Kumar Pandey, Prabal Sen, Ganapathy Saravanavel, Himadri Shekhar Handsa, Mohammed Dilkash Azam, Sidharth Bhatia
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Abstract
A method includes obtaining first data indicative of a measured profile of a substrate. The method further includes obtaining second data indicative of a profile of a reference substrate. The method further includes determining a corrected substrate profile based on the first data and the second data. The method further includes performing a corrective action based on the corrected substrate profile.
Claims19
A method, comprising:
- obtaining, with a displacement sensor of an electronics processing system, first data indicative of a measured profile of a substrate;
- obtaining second data indicative of a profile of a reference substrate;
- determining an out-of-plane distortion of the substrate by subtracting the second data from the first data;
- and
- performing a corrective action based on the out-of-plane distortion, wherein the corrective action comprises:
- determining, based on the out-of-plane distortion, a sector of the substrate to be flattened;
- adjusting at least one parameter associated with a holding force of a sector of a holding device, the sector of the holding device corresponding to the sector of the substrate;
- and
- applying, with the sector of the holding device in a subsequent processing step, the holding force to flatten the sector of the substrate.
A non-transitory machine-readable storage medium storing instructions which, when executed, cause a processing device to perform operations comprising:
- obtaining, with a displacement sensor of an electronics processing system, first data indicative of a measured profile of a substrate;
- obtaining second data indicative of a profile of a reference substrate;
- determining an out-of-plane distortion of the substrate by subtracting the second data from the first data;
- and
- performing a corrective action based on the out-of-plane distortion, wherein the corrective action comprises:
- determining, based on the out-of-plane distortion, a sector of the substrate to be flattened;
- adjusting at least one parameter associated with a holding force of a sector of a holding device, the sector of the holding device corresponding to the sector of the substrate;
- and
- applying, with the sector of the holding device in a subsequent processing step, the holding force to flatten the sector of the substrate.
A system, comprising memory and a processing device coupled to the memory, wherein the processing device is configured to:
- obtain, with a displacement sensor of an electronics processing system, first data indicative of a measured profile of a substrate;
- obtain second data indicative of a profile of a reference substrate;
- determine an out-of-plane distortion of the substrate by subtracting the second data from the first data;
- and
- perform a corrective action based on the out-of-plane distortion, wherein the corrective action comprises:
- determining, based on the out-of-plane distortion, a sector of the substrate to be flattened;
- adjusting at least one parameter associated with a holding force of a sector of a holding device, the sector of the holding device corresponding to the sector of the substrate;
- and
- applying, with the sector of the holding device in a subsequent processing step, the holding force to flatten the sector of the substrate.
Dependencies are inferred from the claim text.