G02B 6/4207
With optical elements reducing the sensitivity to optical feedback
Official title: {with optical elements reducing the sensitivity to optical feedback (anti-reflection devices specially adapted for lasers, see H01S3/0064)}
G02B6/4207 (With optical elements reducing the sensitivity to optical feedback) appears on 783 US grants and 641 published applications in this corpus.
Search patents in G02B- Granted patents
- 783
- Published applications
- 641
- Assignees
- 370
- Inventors
- 1,735
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 9 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 22 | 0 |
| 1992 | 13 | 0 |
| 1993 | 14 | 0 |
| 1994 | 16 | 0 |
| 1995 | 17 | 0 |
| 1996 | 18 | 0 |
| 1997 | 26 | 0 |
| 1998 | 29 | 0 |
| 1999 | 18 | 0 |
| 2000 | 17 | 0 |
| 2001 | 16 | 6 |
| 2002 | 17 | 54 |
| 2003 | 28 | 46 |
| 2004 | 34 | 44 |
| 2005 | 38 | 35 |
| 2006 | 31 | 10 |
| 2007 | 18 | 12 |
| 2008 | 16 | 12 |
| 2009 | 13 | 15 |
| 2010 | 11 | 17 |
| 2011 | 6 | 13 |
| 2012 | 9 | 19 |
| 2013 | 13 | 21 |
| 2014 | 17 | 15 |
| 2015 | 17 | 17 |
| 2016 | 24 | 41 |
| 2017 | 45 | 45 |
| 2018 | 38 | 31 |
| 2019 | 29 | 41 |
| 2020 | 33 | 29 |
| 2021 | 23 | 27 |
| 2022 | 22 | 26 |
| 2023 | 13 | 21 |
| 2024 | 15 | 15 |
| 2025 | 18 | 17 |
| 2026 | 13 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Silicon-based optical component and method of forming the same29 Sep 2026US 12,748,271 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Optical module1 Sep 2026US 12,724,213 B2Sumitomo Electric Industries, Ltd.
- Optical module11 Aug 2026US 12,706,429 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Coupon wafer and method of preparation thereof14 Jul 2026US 12,681,236 B2Rockley Photonics Limited
- Focal polarization beam displacer30 Jun 2026US 12,669,637 B2Cisco Technology, Inc.
- Photonic package8 Oct 2026US 2026/0309945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Device and method for epoxy-free optical integration in photonic integrated circuits27 Aug 2026US 2026/0251860 A1Mixx Technologies, Inc.
- Semiconductor device27 Aug 2026US 2026/0251863 A1Panelsemi Corporation
- Photonic wire bonding methods and processes for the advanced packaging of photonic devices and systems2 Jul 2026US 2026/0184628 A1Aeponyx Inc.
- Photonic wire bonding methods and processes for the advanced packaging of photonic devices and systems2 Jul 2026US 2026/0184629 A1Aeponyx Inc.
Most cited
By later US patents
- Housing structure for coupling and releasing optical modules132US 5,548,677 ASumitomo Electric Industries, Ltd. · 1996
- Optoelectronics package for a semiconductor laser98US 4,752,109 AAMP Incorporated · 1988
- Optical fiber amplifier with flattened gain94US 5,239,607 ABell Communications Research, Inc. · 1993
- Polarization independent optical isolator93US 5,033,830 AAT&T Bell Laboratories · 1991
- Optical device88US 4,548,478 AFujitsu Limited · 1985