G02B 6/12002
Three-dimensional structures
Official title: {Three-dimensional structures}
G02B6/12002 (Three-dimensional structures) appears on 1,108 US grants and 1,313 published applications in this corpus.
Search patents in G02B- Granted patents
- 1,108
- Published applications
- 1,313
- Assignees
- 447
- Inventors
- 2,294
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 4 |
| 2002 | 10 | 20 |
| 2003 | 21 | 37 |
| 2004 | 25 | 35 |
| 2005 | 21 | 26 |
| 2006 | 32 | 28 |
| 2007 | 33 | 32 |
| 2008 | 22 | 17 |
| 2009 | 19 | 13 |
| 2010 | 17 | 22 |
| 2011 | 15 | 12 |
| 2012 | 14 | 13 |
| 2013 | 11 | 28 |
| 2014 | 18 | 24 |
| 2015 | 33 | 45 |
| 2016 | 55 | 52 |
| 2017 | 53 | 57 |
| 2018 | 58 | 68 |
| 2019 | 77 | 76 |
| 2020 | 72 | 79 |
| 2021 | 75 | 76 |
| 2022 | 76 | 81 |
| 2023 | 85 | 120 |
| 2024 | 68 | 120 |
| 2025 | 83 | 134 |
| 2026 | 56 | 94 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical waveguide production method and optical waveguide6 Oct 2026US 12,754,365 B2Sumitomo Electric Industries, Ltd.
- Hybrid bonding with photonic integrated circuits for high bandwidth reticle stitching of reticle sized integrated circuit dies22 Sep 2026US 12,742,927 B2Intel Corporation
- Photonic device22 Sep 2026US 12,742,928 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Optical component22 Sep 2026US 12,742,929 B2Murata Manufacturing Co., Ltd.
- Three-dimensional photonic interconnects1 Sep 2026US 12,724,195 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Hollow core vertical waveguides for photonic interconnects and routing fabrics1 Oct 2026US 2026/0299193 A1
- Semiconductor device with waveguide structure and method for manufacturing the same1 Oct 2026US 2026/0299195 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Waveguide for the analysis of biological samples24 Sep 2026US 2026/0287816 A1Bialoom Ltd
- Multilevel semiconductor device and structure with oxide bonding24 Sep 2026US 2026/0293771 A1Monolithic 3D Inc.
- Electro-Photonic Network For Machine Learning17 Sep 2026US 2026/0276886 A1Celestial AI Inc.
Most cited
By later US patents
- Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof285US 7,016,569 B2Georgia Tech Research Corporation · 2006
- Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making243US 6,343,171 B12002
- Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making206US 6,690,845 B1Fujitsu Limited · 2004
- Optical coupling structures and the fabrication processes197US 6,684,007 B2Fujitsu Limited · 2004
- Method and system of heterogeneous substrate bonding for photonic integration168US 8,630,326 B2Skorpios Technologies, Inc. · 2014