Hybrid bonding with photonic integrated circuits for high bandwidth reticle stitching of reticle sized integrated circuit dies

A process of fabricating a microelectronic assembly, the process comprising:

• placing a plurality of microelectronic sub-assemblies adjacent to each other such that the microelectronic sub-assemblies are coplanar and do not touch each other;
• and
• coupling a photonic integrated circuit (PIC) die with two or more of the microelectronic sub-assemblies,
• wherein an individual microelectronic sub-assembly of the microelectronic sub-assemblies includes:
• an interposer,
• a first plurality of integrated circuit (IC) dies coupled to a first surface of the interposer, and
• a second plurality of IC dies coupled to a second surface of the interposer, the second surface being opposite the first surface.

A microelectronic assembly, comprising:

• microelectronic sub-assemblies arranged in an array;
• and
• a photonic integrated circuit (PIC) die coupled to two or more of the microelectronic sub-assemblies,
• wherein an individual microelectronic sub-assembly of the microelectronic sub-assemblies includes:
• an interposer,
• a first plurality of integrated circuit (IC) dies coupled to a first surface of the interposer, and
• a second plurality of IC dies coupled to a second surface of the interposer, the second surface being opposite the first surface.