G01N 2291/2697
Wafer or electronic parts
Official title: Wafer or (micro)electronic parts
G01N2291/2697 (Wafer or electronic parts) appears on 187 US grants and 210 published applications in this corpus.
Search patents in G01N- Granted patents
- 187
- Published applications
- 210
- Assignees
- 141
- Inventors
- 552
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 3 |
| 2005 | 3 | 5 |
| 2006 | 1 | 1 |
| 2007 | 3 | 2 |
| 2008 | 2 | 5 |
| 2009 | 0 | 5 |
| 2010 | 2 | 3 |
| 2011 | 3 | 5 |
| 2012 | 2 | 4 |
| 2013 | 3 | 10 |
| 2014 | 7 | 6 |
| 2015 | 5 | 9 |
| 2016 | 10 | 10 |
| 2017 | 5 | 7 |
| 2018 | 14 | 8 |
| 2019 | 5 | 13 |
| 2020 | 12 | 17 |
| 2021 | 10 | 22 |
| 2022 | 14 | 19 |
| 2023 | 17 | 19 |
| 2024 | 16 | 10 |
| 2025 | 15 | 18 |
| 2026 | 12 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer chuck having multiple simultaneously actuated wafer contact fingers for handling a wafer8 Sep 2026US 12,733,447 B2Pva Tepla Analytical Systems GmbH
- Non-destructive inspection method including inspecting multiple observation sites and method of manufacturing semiconductor memory device using the same25 Aug 2026US 12,716,832 B2Samsung Electronics Co., Ltd.
- Non-invasive advanced sensory system for real-time monitoring and diagnosis of electrolyzers, electrolytes and a lithium-ion battery (LIB)2 Jun 2026US 12,644,865 B2Honeywell International Inc.
- Depth profiling of semiconductor structures using multi-wavelength pump-probe technique19 May 2026US 12,631,442 B2Applied Materials Israel Ltd.
- Methods and apparatus for acoustic metrology5 May 2026US 12,618,804 B2ASML Netherlands B. V.
- Processing chambers for cleaning and inspection of bonded substrates and related methods27 Aug 2026US 2026/0251617 A1APPLIED Materials.Inc.
- Metrology and inspection apparatus for material layer including three-dimensional nanostructures, method of manufacturing semiconductor device using the same, and method of performing metrology and inspection13 Aug 2026US 2026/0235556 A1Samsung Electronics Co., Ltd.
- Metrology method and associated metrology device6 Aug 2026US 2026/0227426 A1ASML Netherlands B. V.
- Systems for performing acoustic measurement of batteries30 Jul 2026US 2026/0219238 A1Liminal Insights, Inc.
- Scanning acoustic microscopy2 Jul 2026US 2026/0185965 A1Intel Corporation
Most cited
By later US patents
- Laser ultrasonics-based material analysis system and method using matched filter processing140US 5,604,592 ATextron Defense Systems, Division of Avco Corporation · 1997
- Laser ultrasonics-based material analysis system and method122US 5,638,396 ATextron Systems Corporation · 1997
- Method for evaluating the quality of the bond between two members utilizing thermoacoustic microscopy60US 4,484,820 ATherma-Wave, Inc. · 1984
- Laser ultrasonics-based material analysis system and method40US 5,781,304 ATextron Systems Corporation · 1998
- Apparatus for detecting wafer edge defects and method of using30US 6,062,084 ATaiwan Semiconductor Manufacturing Company.Ltd · 2000