Wafer chuck having multiple simultaneously actuated wafer contact fingers for handling a wafer
AssigneePva Tepla Analytical Systems GmbH
InventorsPeter Hoffrogge, Mario Lowack
Life of this patent
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AssigneePva Tepla Analytical Systems GmbH
InventorsPeter Hoffrogge, Mario Lowack
Estimating the term…
A wafer chuck for handling a wafer that can be used in a wafer process device or in a scanning acoustic microscope. The wafter chuck having a fixing device for the wafer. Wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relative to the holder for a wafer. The wafer contact fingers are arranged annularly around the free space for the wafer, such as in one plane. The wafer contact fingers can be moved in the direction of the free space for the wafer or can be moved away from the free space for the wafer. One actuation device for the wafer contact fingers is provided and, when the actuation device is actuated, the wafer contact fingers are moved or can be moved simultaneously.
A wafer chuck for handling a wafer in a wafer process device, the wafer chuck comprising:
A method of fixing a wafer in a wafer process device, the method comprising:
Dependencies are inferred from the claim text.