G01N 19/04
Measuring adhesive force between materials
Official title: Measuring adhesive force between materials, e.g. of sealing tape, of coating
G01N19/04 (Measuring adhesive force between materials) appears on 581 US grants and 471 published applications in this corpus.
Search patents in G01N- Granted patents
- 581
- Published applications
- 471
- Assignees
- 437
- Inventors
- 1,491
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 12 | 0 |
| 1990 | 11 | 0 |
| 1991 | 9 | 0 |
| 1992 | 8 | 0 |
| 1993 | 4 | 0 |
| 1994 | 10 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 13 | 0 |
| 1998 | 11 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 4 |
| 2002 | 11 | 7 |
| 2003 | 14 | 12 |
| 2004 | 11 | 17 |
| 2005 | 8 | 13 |
| 2006 | 7 | 11 |
| 2007 | 8 | 11 |
| 2008 | 10 | 14 |
| 2009 | 14 | 16 |
| 2010 | 16 | 22 |
| 2011 | 14 | 15 |
| 2012 | 16 | 13 |
| 2013 | 19 | 28 |
| 2014 | 15 | 19 |
| 2015 | 18 | 27 |
| 2016 | 20 | 36 |
| 2017 | 22 | 16 |
| 2018 | 30 | 26 |
| 2019 | 20 | 23 |
| 2020 | 23 | 15 |
| 2021 | 18 | 23 |
| 2022 | 16 | 24 |
| 2023 | 18 | 15 |
| 2024 | 23 | 25 |
| 2025 | 22 | 24 |
| 2026 | 13 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- In situ mechanical characterization of a sample strain29 Sep 2026US 12,748,129 B2NUtech Ventures
- Laminate and roll22 Sep 2026US 12,742,290 B2Toppan Holdings Inc.
- Wafer-level bond strength measurement22 Sep 2026US 12,742,722 B2Intel Corporation
- Apparatus for measuring sealing strength25 Aug 2026US 12,716,821 B2SK On Co., Ltd.
- Torsional shear testing for semiconductor surface bonds18 Aug 2026US 12,710,344 B2Tokyo Electron Limited
- System and method for testing a painted surface of a structure3 Sep 2026US 2026/0259189 A1The Boeing Company
- Coating film cutting apparatus20 Aug 2026US 2026/0243645 A1Allgood Co., Ltd.
- Method for measuring peel strength of metal-bonded ceramic substrate, method for manufacturing metal-bonded ceramic substrate, and metal bonded ceramic substrate manufactured thereby20 Aug 2026US 2026/0243657 A1Amogreentech Co., Ltd.
- Method and system for cementing simulation and gas-water back-invasion evaluation in complex formations9 Jul 2026US 2026/0193976 A1Chengdu University of Technology
- Recording device28 May 2026US 2026/0145449 A1Seiko Epson Corporation
Most cited
By later US patents
- Adhesive microstructure and method of forming same98US 6,737,160 B1The Regents of the University of California · 2004
- Valve seat insert and cylinder head with the valve seat insert69US 4,763,876 ANGK Insulators, Ltd. · 1988
- Adhesive microstructure and method of forming same68US 7,011,723 B2The Board of Trustees of the Leland Stanford Junior University · 2006
- Adhesive microstructure and method of forming same50US 7,229,685 B2The Regents of the University of California · 2007
- Method and device for simultaneously determining the adhesion, friction, and other material properties of a sample surface42US 6,880,386 B1Witec Wissenschaftliche Instrumente und Technologie GmbH · 2005