Torsional shear testing for semiconductor surface bonds

A method of testing semiconductor surface bonds, the method comprising:

• centering a torsional shear tool with respect to a first wafer portion having a surface bond to a second wafer portion, wherein the second wafer portion is held fixed with respect to the torsional shear tool;
• clamping the first wafer portion using the torsional shear tool;
• applying a torsional load to the first wafer portion with respect to the second wafer portion using the torsional shear tool;
• wherein clamping the first wafer portion and applying the torsional load further comprise clamping with jaws, the jaws comprising at least one of:
• two opposing jaws;
• and two pairs of opposing jaws, wherein each pair of opposing jaws are orthogonal to each other;
• and
• measuring a torque value associated with the torsional load.

A torsional shear tool for testing bond strength of semiconductor surface bonds, the torsional shear tool comprising:

• a frame fixed to a spindle enabled to apply torque to the frame;
• a sensor coupled to the spindle and enabled to measure a torque value of the torque being applied;
• and
• at least one pair of opposing jaws coupled to the frame, the opposing jaws enabled to clamp a semiconductor die at vertical edges of the semiconductor die and transmit the torque applied by the spindle to the semiconductor die,
• wherein when the semiconductor die has a surface bond to a substrate that is held stationary with respect to the torsional shear tool, the spindle and opposing jaws are enabled to apply a torque value of the torque sufficient to break the surface bond, wherein the torque value is applied in-plane to the surface bond.