Wafer-level bond strength measurement
AssigneeIntel Corporation
InventorKhaled Ahmed
Life of this patent
Estimating the term…
Abstract
This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
Claims20
A system, comprising:
- a first portion of a plate connected to a movement mechanism;
- a second portion of the plate comprising a probe;
- a third portion of the plate comprising a mirror integrated into the plate with a reflective side pointing outwards;
- and
- an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber, wherein the optical fiber sensor assembly is configured to calculate a differential position of the plate based on a time difference between a sent light signal and a received light signal reflected from the mirror.
A method comprising:
- sending a first light signal through a first optical fiber of a fiber bundle;
- receiving a second light signal through a second fiber optical fiber of the fiber bundle, wherein the second light signal is reflected on a mirror that is a portion of a plate;
- calculating a time difference between sending the first light signal and receiving the second light signal;
- translating the plate in a direction perpendicular to the plate;
- re-calculating the time difference;
- and
- determining a differential position based on the time difference.
An apparatus for bond strength measurement, the apparatus comprising:
- a first portion of a metal plate connected to a movement mechanism;
- a second portion of the metal plate comprising a polydimethylsiloxane (PDMS) probe to adhere to a top surface of a silicon wafer;
- and
- an optical fiber sensor assembly comprising a mirror integrated into the metal plate, a plurality of optical fibers, a laser, and a photodetector configured to determine a differential position of the metal plate based on a time differential between a sent light signal and a received light signal.
Dependencies are inferred from the claim text.