G01B 2210/64
Interconnection or interfacing through or under capping or via rear of substrate
Official title: Interconnection or interfacing through or under capping or via rear of substrate in microsensors
G01B2210/64 (Interconnection or interfacing through or under capping or via rear of substrate) appears on 12 US grants and 0 published applications in this corpus.
Search patents in G01B- Granted patents
- 12
- Published applications
- 0
- Assignees
- 10
- Inventors
- 18
- Latest grant
- 4 Nov 1997
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Transistor and circuit incorporating same4 Nov 1997US 5,683,919 ATexas Instruments Incorporated
- Sealed cavity arrangement method7 Jan 1997US 5,591,679 ASensonor A/S
- Backside contact of sensor microstructures30 Apr 1996US 5,511,428 AMassachusetts Institute of Technology
- Semiconductor device having sealed electrical feedthrough20 Aug 1991US 5,041,900 AHamilton Standard Controls, Inc.
- Method of sealing an electrical feedthrough in a semiconductor device18 Jul 1989US 4,849,374 ASpectrol Reliance Limited
No published applications in this class yet.
Most cited
By later US patents
- Backside contact of sensor microstructures152US 5,511,428 AMassachusetts Institute of Technology · 1996
- Method of making silicon capacitive pressure sensor with glass layer between silicon wafers101US 4,773,972 AFord Motor Company · 1988
- Sealed cavity arrangement method70US 5,591,679 ASensonor A/S · 1997
- Ultra-thin microelectronic pressure sensors64US 4,426,768 AUnited Technologies Corporation · 1984
- Ultra-thin microelectronic pressure sensors37US 4,463,336 AUnited Technologies Corporation · 1984